Integrated circuits are placed into protective packages in order to allow efficient assembly and handling onto PCBs (printed circuit boards) and to protect the electronic devices from damage. Different sort of packaging techniques are present. Packaged IC component inspector systems primarily increase the throughput and boost the package changeover than traditional methods. The market has been segmented into by IC packaged inspection type surface mounting, through-hole mounting, pin grid array, ball grid array, flip chip inspection, plastic encapsulated IC inspection, flat package, molded underfill inspection among others. Moreover, the market has been also segmented by end use industry which includes consumer electronics, industrial equipment, aerospace and military, automotive, telecommunication, healthcare among others. The market for packaged IC component inspector by region has been segmented into, Europe, Asia Pacific, North America, MEA (Middle East and Africa) and South America.