Deerfield Beach, FL -- (SBWIRE) -- 07/26/2016 -- Global Flip-Chip Technologies is estimated $25.89 billion in 2015.

Global Flip-Chip Technologies is growing at a CAGR of 11.94% During forecast period 2015 to 2022.

Global Flip-Chip Technologies is expected to reach value $57.04 billion till year 2022.

Report Segmented based on: Wafer Bumping Process Covered, End Use Covered, Applications Covered, Regions Covered.

Global Flip-Chip Technologies geographically segmented into: North America, Europe, Asia Pacific, Rest of the World.

Key players in Flip-Chip Technologies are IBM Corp., Samsung Electronics Co. Ltd., Texas Instruments Inc., Amkor Technology Inc., Intel Corp., Taiwan Semiconductor Manufacturing Co., Global Foundries U.S. Inc., Powertech Technology Inc. and Advanced Semiconductor Engineering Inc, Nepes Pte. Ltd., Stmicroelectronics NV (STM) and Stats Chippac Ltd.

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What our report offers:

- Flip-Chip Technologies share assessments for the regional as well as country level segments

- Flip-Chip Technologies share analysis of the top industry players

- Flip-Chip Technologies report also recommendations for the new entrants

- Flip-Chip Technologies forecasts for a minimum of 8 years of all the mentioned segments

- Flip-Chip Technologies Forecasts for sub segments and the regional markets

- Flip-Chip Technologies Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)

- Report on Flip-Chip Technologies also recommended key business segments based on the Flip-Chip Technologies estimations

- Competitive landscaping mapping the key common Flip-Chip Technologies trends

- Company profiling with detailed Flip-Chip Technologies strategies, financials, and recent developments

- Supply chain trends mapping the latest technological advancements

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