New York, NY -- (SBWire) -- 08/30/2018 --In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
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Market Segment on the basis of Top Manufacturers - TSMC (Taiwan), Samsung (South Korea), Toshiba (Japan), ASE Group (Taiwan), Amkor (U.S.), UMC (Taiwan), Stmicroelectronics (Switzerland), Broadcom (U.S.), Intel (U.S.), Jiangsu Changjiang Electronics (China)
The research further examines and provides data on the market by type, application and geography interspersed with illustrations and other graphical representations. The market analysis not only determines the attractiveness of the industry but also the evolving challenges and opportunities and their association with the weaknesses and strengths of prominent market leaders. Most importantly, the document empowers business owners to seek information about potential consumers and where they can find them. Apart from this, the literature sheds light on how major vendors operating in the 3D IC and 2.5D IC market are making the best use of their marketing campaigns.
Market Segment on the basis of Product, the report covers:
- 3D wafer-level chip-scale packaging
- 3D TSV
- 2.5D
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Market Segment on the basis of Industry, the report covers:
- Consumer electronics
- Telecommunication
- Industry sector
- Automotive
- Military and Aerospace
- Smart technologies
- Medical devices
Key Topics Covered:
- 3D IC and 2.5D IC Market Overview
- Global 3D IC and 2.5D IC Market Competition by Manufacturers
- Global 3D IC and 2.5D IC Capacity, Production, Revenue (Value) by Region (2013-2018)
- Global 3D IC and 2.5D IC Supply (Production), Consumption, Export, Import by Region (2013-2018)
- Global 3D IC and 2.5D IC Production, Revenue (Value), Price Trend by Type
- Global 3D IC and 2.5D IC Market Analysis by Application
- Global 3D IC and 2.5D IC Manufacturers Profiles/Analysis
The study segments the complete 3D IC and 2.5D IC market on the basis of different application, end-use, end-user, and production capability. From a business standpoint, the industry has been thoroughly examined across various countries located in North America, Europe, Asia-Pacific, and others. The size of the industry for the forecast period 2018 - 2025 is evaluated on the basis of current sales figures and past financial report can be used to forecast the future sales.
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3D IC and 2.5D IC Market Forecast 2018-2025: Top Players Like ASE Group, Amkor, UMC, Stmicroelectronics, Broadcom, Samsung, TSMC
The study is a professional probe into the revenue generated and capacity estimates for the 3D IC and 2.5D IC market for the forecast period 2018 - 2025 empower the business owners to maintain a competitive edge over their rivals.