New York, NY -- (SBWire) -- 01/12/2016 --According to a recent market research report published by Persistence Market Research (PMR), the global market for semiconductor assembly and testing services will grow at a moderate, but positive pace over the course of 2015-2021.
The report, titled "Global Market Study on Semiconductor Assembly & Testing Services (SATS): To be Driven by Increasing Demand for High-End Packaging Solutions", states that the market will expand at a 4.7% CAGR between 2015 and 2021. As a result, the market, which is expected to have a valuation of US$29,585.9 mn by the end of 2015, is projected to rise to US$39,050.7 mn by 2021.
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The report states that the global semiconductor assembly and testing services market is chiefly driven by factors such as the rising demand for connectivity and mobility in consumer electronics, an overall rise in the usage of connected devices across numerous industries, and the flourishing market for smartphones and tablets. The multimedia and connectivity capabilities of smartphones and tablets are leading to an increased demand for improved and more sophisticated packaging technologies, thereby creating potential growth opportunities for the global semiconductor assembly and testing services market.
The report segments the global SATS market on the basis of three criteria: service, application, and geography.
The key services provided by the global SATS market, analyzed in the report, are testing services and assembly and packaging services. Of these, the segment of assembly and packaging services is expected to account for a 79.0% share in the global SATS market by the end of 2015 and expand at a 4.9% CAGR over the report's forecast period.
On the basis of assembly and packaging services, the market is further segmented into copper wire and gold wire bonding packaging solutions, flip clip packaging solutions, copper clip packaging solutions, TSV packaging solutions, and wafer level packaging solutions. Of these, the segment of copper and gold wire bonding solutions accounted for a 55.5% of the overall market. The segment of wafer level packaging solutions is expected to grow at the fastest pace amongst all the packaging solutions, at a projected CAGR of 9.2% over the report's forecast period.
On the basis of application, the report segments the market into consumer electronics, industrial and automotive electronics, computing and networking, and communications. Of these, the segment of communications dominated the market by accounting for a 49.4% share in the market in 2014. The rising adoption of tablet computers and wearable devices across the globe is expected to drive increased demand for semiconductor assembly and testing services in the consumer electronics segment, subsequently propelling the global SATS market.
On the basis of region, the semiconductor assembly and testing services market is segmented into North America, Latin America, Asia Pacific (except Taiwan), Europe, Taiwan, and Middle East and Africa. Of these, Taiwan is expected to dominate the global SATS market by accounting for over 46.5% share in the market by the end of 2015.
View Detail Report: http://www.persistencemarketresearch.com/market-research/semiconductor-assembly-test-services-market.asp
Some of the key vendors in the global semiconductor assembly and testing services market are CORWIL Technology corporation, ASE Group, STATS ChipPAC Ltd. (JCET), Amkor Technologies Inc., Powertech Technology Inc., Silicon Precision Industries Co. Ltd., Chipbond Technology Corporation, GlobalFoundries, and Psi Technologies Inc. (IMI).
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Consumer Electronics Devices to Drive Global Semiconductor Assembly and Testing Services Market as Mobility and Connectivity Become Paramount
The global semiconductor assembly & testing services market is anticipated to expand at a CAGR of 4.7% during the period 2015-2021 to reach US$ 39,050.7 Mn by 2021.