Pune, India -- (SBWire) -- 02/20/2019 --The Global Molded Interconnect Device Market is expected to reach USD 2119.85 million by 2025, from USD 786.21 million in 2017 growing at a CAGR of 13.2% during the forecast period of 2018 to 2025. The upcoming market report contains data for historic years 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.
As per survey conducted by Statista, the number of connected installed devices in 2017 was at 20.35 billion while with current trends and increasing adaption the same is forecasted to surpass 75.44 billion by 2025. The total sale in the automotive industry was valued to be 81.5 million units.
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Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and Brazil among others.
Major Market Drivers and Restraints:
- High trends of wearable devices and its penetration in the market.
- Increasing focus on reducing electronic wastes.
- Increasing usage of MID in healthcare.
- Internet of Things (IoT) and its growing demand among industries.
- High costs of raw materials and tooling.
- Extent of incompatibility with other electronic systems.
Major Market Competitors/Players:
- MacDermind Inc.,
- Molex Llc,
- LPKF,
- TE Connectivity,
- HARTING Technology Group,
And More other Companies are Arlington Plating Company, Johnan America Inc., MID Solutions GmbH, LaserMicronics, Yomura, TactoTek Corporation, DowDuPont (The Dow Chemical Company, DuPont), Multiple Dimensions AG, Galtronics USA ltd., Teprosa GmbH, Cicor Management AG, 2E Mechatronic, RTP Company, TONGDA Group, and S2P Smart Plastic Products S2P among others.
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Market Segmentation:
Based on the product,
1. Antennae and connectivity modules,
2. Sensors,
3. Connectors and switches,
4. Lighting and others
Based on process,
1. Laser direct structuring,
2. Two-shot molding, others
Based on end users,
1. Automotive,
2. Consumer products,
3. Healthcare,
4. Industrial,
5. Military and aerospace,
6. Telecommunication and computing, and others.
Based on geography
1. North America & South America,
2. Europe,
3. Asia-Pacific
4. Middle East & Africa
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Molded Interconnect Device Market Opportunities, in-Depth Overview, Regional Outlook, Industry Analysis, Growth Impact and Demand Forecast to 2025: Molex, TE Connectivity
Global Molded Interconnect Device Market report provides an Industry overview of the its characteristics, market size and growth, industry segmentation, market shares, trends and Key player strategies, industry chain structure, development history & status, competitive landscape analysis