Laser Direct Imaging System Market Report with detailed market segmentation, The report also includes the detailed company profiles of the key players in the market along with their market strategies.

Los Angeles, CA -- (SBWire) -- 11/02/2018 --The Laser Direct Imaging (LDI) System offers auto focus capabilities so that the system can handle different thicknesses of material and rapid job change-overs without expensive tooling.

Compared to 2016, Laser Direct Imaging (LDI) System market managed to increase revenue by 6.41 percent to $606.44 million worldwide in 2017 from $569.62 million USD in 2016. The reason causes this increase is the rising demand for the Laser Direct Imaging (LDI) System products, which is the result of the spurring needs of downstream customers (PCB manufacturers). The global Laser Direct Imaging (LDI) System market volume is expected to reach 686 units by 2023 from 482 units in 2018, growing at a CAGR of 7.31% from 2018 to 2023. Overall, the Laser Direct Imaging (LDI) System market performance is positive, despite the weak economic environment.

This report studies the Laser Direct Imaging (LDI) System market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Laser Direct Imaging (LDI) System market by product type and applications/end industries.

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The major players in global Laser Direct Imaging (LDI) System market include

Orbotech

ORC Manufacturing

Fuji Film

SCREEN

Via Mechanics

Manz

Limata

Delphi Laser

Han's CNC

Aiscent

AdvanTools

Geographically, this report is segmented into several key regions, with revenue, market share (%) and growth Rate (%) of Laser Direct Imaging (LDI) System in these regions, from 2013 to 2023 (forecast), covering

USA

China

Europe

Japan

South Korea

Taiwan

ROW

On the basis of product, the Laser Direct Imaging (LDI) System market is primarily split into

Polygon Mirror 365nm

DMD 405nm

On the basis on the end users/applications, this report covers

Standard and HDI PCB

Solder Mask

Thick-Copper and Ceramic PCB

Oversized PCB

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