Epoxy Molding Compounds Market Is Expected to 2490 Million Usd by the End of 2025
Epoxy Molding Compounds Market is a detailed report, which presents a combination of industry knowledge and research expertise based on regions too. This report delivers the market trends along with the market size for every individual sector.
Los Angeles, CA -- (SBWire) -- 04/17/2019 --EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing. The global Epoxy Molding Compounds industry has a high market concentration. The major manufacturers are concentrated in Japan, China and Korea, such as Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group and KCC.
The global consumption of Epoxy Molding Compounds increases from 228.37 K MT in 2017 to 327.15 K MT in 2025, at a CAGR of 4.60%. In 2017, the global Epoxy Molding Compounds consumption market is led by Asia-Pacific and Asia-Pacific is the largest region consumption market, accounting for about 88.01% of global consumption of Epoxy Molding Compounds. The global Epoxy Molding Compounds market was 1940 million US$ in 2018 and is expected to 2490 million US$ by the end of 2025, growing at a CAGR of 3.7% between 2019 and 2025.
This report studies the Epoxy Molding Compounds market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
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Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Epoxy Molding Compounds in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
By the product type, the market is primarily split into
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
By the end users/application, this report covers the following segments
Semiconductor Encapsulation
Electronic Components
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