The report is a powerful tool that market participants can use to cement a strong position in the global Solder Paste Inspection (SPI) System market. It comprises in-depth analysis that enables readers to receive a sound understanding of the growth and other critical factors that define the global Solder Paste Inspection (SPI) System market.

Los Angeles, CA -- (SBWire) -- 05/07/2019 --The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.

Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.

The global Solder Paste Inspection (SPI) System market was 240 million US$ in 2018 and is expected to 330 million US$ by the end of 2025, growing at a CAGR of 4.2% between 2019 and 2025.

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The key manufacturers in this market include

Koh Young (Korea)

CyberOptics Corporation

Test Research, Inc (TRI) (Taiwan)

MirTec Ltd (Korea)

PARMI Corp (Korea)

Viscom AG (Germany)

ViTrox (Malaysia)

Vi TECHNOLOGY (France)

Mek (Marantz Electronics) (Japan)

CKD Corporation (Japan)

Pemtron (Korea)

SAKI Corporation (Japan)

Machine Vision Products (MVP) (US)

Caltex Scientific (US)

ASC International (US)

Sinic-Tek Vision Technology (China)

Shenzhen JT Automation Equipment (China)

Jet Technology (Taiwan)

By the product type, the market is primarily split into

In-line SPI System

Off-line SPI System

By the end users/application, this report covers the following segments

Automotive Electronics

Consumer Electronics

Industrials

Others

Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of Solder Paste Inspection (SPI) System in these regions, from 2014 to 2025 (forecast), like

North America

Europe

China

Japan

Asia Others

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Take a look at some of the important sections of the report:

Study Coverage: It includes key manufacturers covered in the report and highlights of product type and application segments of the global Solder Paste Inspection (SPI) System market. Some of the other chapters included in this section are years considered, product scope, and study objectives.

Executive Summary: This part of the report offers growth rate and market size analysis by region. It also provides analysis of revenue and sales by region.

Breakdown Data by Manufacturer: Sales, revenue, and price are three critical factors analyzed here. This section also includes analysis of manufacturing base distribution, products offered by manufacturers, expansion plans, mergers, and acquisitions.

Breakdown Data by Product: Here, sales, revenue, and price are analyzed on the basis of type of product.

Breakdown Data by Application: It provides breakdown data of the global Solder Paste Inspection (SPI) System market by application.

Geographical Analysis: All key regions and countries are assessed here on the basis of company, type of product, and application. This section includes a study on revenue, sales, and production of all regional and country-level markets.

Company Profiles: Key players of the global Solder Paste Inspection (SPI) System market are profiled on the basis of gross margin, revenue, sales, recent developments, and other factors.

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