3D ICs Market New Research Report Announced with business priorities in order to assist companies to realign their business strategies.

Los Angeles, CA -- (SBWire) -- 06/04/2019 --3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.

3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.

The global 3D ICs market was xx million US$ in 2018 and is expected to xx million US$ by the end of 2025, growing at a CAGR of xx% between 2019 and 2025.

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This report studies the 3D ICs market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of 3D ICs in these regions, from 2014 to 2025, covering

North America (United States, Canada and Mexico)

Europe (Germany, UK, France, Italy, Russia and Turkey etc.)

Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)

South America (Brazil etc.)

Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

Xilinx

Advanced Semiconductor Engineering (ASE)

Samsung

STMicroelectronics

Taiwan Semiconductors Manufacturing (TSMC)

Toshiba

EV Group

Tessera

By the product type, the market is primarily split into

3D SiCs

Monolithic 3D ICs

By the end users/application, this report covers the following segments

Automotive

Smart Technologies

Robotics

Electronics

Medical

Industrial

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