Fast Market Research recommends "Taiwanese IC Packaging & Testing Industry, 4Q 2013" from Market Intelligence and Consulting Institute, now available

Boston, MA -- (SBWire) -- 01/22/2014 --This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to expand in the third quarter of 2013, registering a 5.0% sequential growth to around US$3.27 billion. However, the industry's shipment value is expected to slip 3.4% sequentially to around US$3.16 billion in the fourth quarter.

Companies Mentioned in this Report: Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton, AAC Technologies, Ainsun, Amoi, Anhui Huatian, Apanda, AUX, BBK, Bird, BOE, Cafephone, Captiel, CECT, China Netcom, China Telecom, China Unicom, COKI, Conor, CoolPad, Coslight Technology, Desay, Dongguan EON, Doov, EBEST, Everwin Precision, Fastprint, Galaxycore, GaoXinqi, Gettop Acoustic, Gfive, Ginoee, Gnote, GoerTek, GooPhone, Guangdong Goworld, HILIVE, Hisense, Hisilicon, Huizhou Speed Wireless

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