Global Semiconductor Packaging Materials Market to Grow at a CAGR of 4.33 Percent over the Period 2015-2019

The Report Global Semiconductor Packaging Materials Market 2015-2019 provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. - MarketResearchReports.biz

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Albany, NY -- (SBWire) -- 03/05/2015 --About Semiconductor Packaging Materials

Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect the die and the PCB. They protect the die from external mechanical impacts and corrosion, and also act as an electrically conductive interconnects with excellent signal propagation properties. Excessive heat in the circuits is dissipated through heat spreaders. Packaging components vary in dimensions and functionality.

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TechNavio's analysts forecast the Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33 percent over the period 2014-2019.

Covered in this Report

The Global Semiconductor Packaging Materials market can be divided into seven segments based on the type of product: Organic Substrates, Bonding Wires, Leadframes, Encapsulation Resins, Ceramic Packages, Die Attach Materials, and Other Semiconductor Packaging Materials. The key consumers of these packaging materials are the Electronics Industry, the Semiconductor Industry, and the Automotive Sector.

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TechNavio's report, Global Semiconductor Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, and Europe; it also covers the Global Semiconductor Packaging Materials market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

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Key Regions

APAC
Europe
North America
Key Vendors
Alent
BASF
Henkel
Hitachi Chemical
Kyocera

Other Prominent Vendors

Beijing Doublink Solders
Beijing Kehua New Chemical Technology
Cheil Industries
Diehl Metall
Duksan Hi-metal
DuPont
Dynacraft
Evergreen Semiconductor Materials
Guangdong Rongtai
Heesung Metal
Heraeus
Honeywell Electronic Materials
Ibiden
Indium
IQE
KCC
LG Innotek
Lintec
Lord
Mitsui High-Tec
MK Electron
Nanya PCB
Ningbo Dongsheng IC
Nippon Micrometal
Nitto Denko
Poongsan
Samsung Techwin
Shanghai Sinyang Semiconductor Materials
Shin-Etsu Chemical
Shinko
Sumitomo Metal Mining
Tanaka Denshi Kogyo
Tatsuta Electronic Materials
Xiamen Yonghong Electronics

Key Market Driver

Surge in Sales of Smartphones and Smart Devices
For a full, detailed list, view our report

Key Market Challenge

High Dependency on Performance of Semiconductor Equipment Industry
For a full, detailed list, view our report

Key Market Trend

Popularity of Redistributed Chip Packaging
For a full, detailed list, view our report

Key Questions Answered in this Report

What will the market size be in 2019 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

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