Persistence Market Research Pvt. Ltd is released new forthcoming report on title "Semiconductor assembly and Test Services Market: Global Industry Analysis and Forecast 2015 - 2021".

New York, NY -- (SBWire) -- 09/16/2015 --Semiconductor Assembly and Test Services (SATS) are shifting rapidly towards outsourcing mode of business. At present around 50% of the market is utilizing Outsourced Semiconductor Assembly and Test (OSAT). This figure is expected to grow in the next coming years. Semiconductor packaging and test services market is expected to recover slowly as there is growing trend for outsourcing by OEMs and chipmakers. However, there is a possibility of market consolidation owing to financial stress and persistent excess capacity. In the future a huge investment will be necessary for supporting new trends and technologies, thus, a market consolidation would be required. Investment in copper wire, 3D packaging and TVS are very high.

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These happenings are primarily by integrated device manufacturers (IDMs) and Japanese original equipment manufacturers, which have shifted their packaging operations and test operations to SATS providers. Such kind of outsourcing is expected to remain same as companies are bound to keep pace with growing complexity in packaging technology.

Though many low-end suppliers are fighting on the price-sensitive products the top leaders such as ASE, Amkor Technology, STATS and Siliconware Precision Industries Co. Ltd. are aiming the big and more expensive packages which requires huge investment and latest technologies. In reality, packaging has become complex and costly with the upgradation and development of silicon based technology. As the business is shifting towards 3D packaging solutions there are expected be abundant cases where the package cost will be more as compared to the silicon cost.

The outsourced semiconductor assembly and test services market is expected to have considerable growth that is lead by the surge in the packaging costs and a fast transformation for adoption of outsourcing model in the next coming years. In addition, major drivers acting in the market include rising adoption of packaging and assembly technologies in several electronic and portable devices, incompetency of electronic outsourcing services industry to serve the demand of middle market, fast development of outsourced semiconductor assembly and test (OSAT) companies in the Southeast Asian region and shift of Japanese chipmakers towards outsourcing of assembly & test operations. In addition, the global semiconductor assembly and test services market has been experiencing growth in the number of collaborations and alliances among providers and manufacturers. Although, cyclic characteristics of the semiconductor industry could challenge the growth of SATS market.

SATS find application in the fabrication, packaging and testing stage of semiconductor production. Key players in the market include mkor Technology, BE Semiconductor Industries, Denis Ferranti Group, PSI Technologies, Cirtek Electronics Corporation, IBM Microelectronics, STATS ChipPAC, Unisem (M), Toshiba Semiconductor & Storage Products Company, ChipMOS Technologies and STATS ChipPAC Ltd. among others. ASE, AMKOR, STATS ChipPAC and SPIL have been in the packaging market, assembly and test markets since the last dacade. These four leaders are continuously developing new business models and technologies to acquire economic profit.

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Key points covered in the report
1) Report segments the market on the basis of types, application, products, technology, etc (as applicable)
2) The report covers geographic segmentation

North America
Europe
Asia
RoW

3) The report provides the market size and forecast for the different segments and geographies for the period of 2010 to 2020
4) The report provides company profiles of some of the leading companies operating in the market
5) The report also provides porters five forces analysis of the market.

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