New Market Research Report: Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

Fast Market Research announces the availability of the new TechNavio report, "Global Semiconductor Packaging and Assembly Equipment Market 2016-2020", on their comprehensive research portal

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Boston, MA -- (SBWire) -- 02/09/2016 --For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

Technavio's analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

Get More Details on this Report and a Full Table of Contents at Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

The market is divided into the following segments based on type:

-Die- level packaging and assembly equipment
-Wafer-level packaging and assembly equipment

Technavio's report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

-Applied Materials
-ASMPT
-DISCO
-EVG
-Kulicke and Soffa Industries
-TEL
-Tokyo Seimitsu

Other prominent vendors

-Rudolph Technologies
-SEMES
-Suss Microtec
-Ultratech
-Ulvac Technologies

Market driver

-Rising demand for polymer adhesive wafer bonding equipment
-For a full, detailed list, view our report

Market challenge

-Fluctuating foreign exchange rates
-For a full, detailed list, view our report

Market trend

-Higher number of mergers and acquisitions (M&A)
-For a full, detailed list, view our report

Key questions answered in this report

-What will the market size be in 2020 and what will the growth rate be?
-What are the key market trends?
-What is driving this market?
-What are the challenges to market growth?
-Who are the key vendors in this market space?
-What are the market opportunities and threats faced by the key vendors?
-What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Companies Mentioned in this Report: Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Ultratech, Ulvac Technologies

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-Global Wafer-level Manufacturing Equipment Market 2016-2020
-Global Semiconductor Packaging Materials Market 2015-2019

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View this press release online at: http://rwire.com/661360