Global 3D Semiconductor Packaging Market 2016-2020 - New Market Report

Fast Market Research announces the availability of the new TechNavio report, "Global 3D Semiconductor Packaging Market 2016-2020", on their comprehensive research portal

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Boston, MA -- (SBWire) -- 08/01/2016 --Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period.

Technavio's analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020.

Get More Details on this Report and a Full Table of Contents at Global 3D Semiconductor Packaging Market 2016-2020

Covered in this report
The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers.

The market is divided into the following segments based on geography:

-Americas
-APAC
-EMEA

Technavio's report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

-Amkor Technology
-SUSS Microtek
-EV Group
-Tokyo Electron

Other prominent vendors

-ACCRETECH Tokyo Seimitsu
-Rudolph Technologies
-SEMES
-Ultratech
-ULVAC

Market driver

-Need to control chip design costs
-For a full, detailed list, view our report

Market challenge

-High capital investment in 3D semiconductor packaging
-For a full, detailed list, view our report

Market trend

-Short replacement cycle of portable electronic devices
-For a full, detailed list, view our report

Key questions answered in this report

-What will the market size be in 2020 and what will the growth rate be?
-What are the key market trends?
-What is driving this market?
-What are the challenges to market growth?
-Who are the key vendors in this market space?
-What are the market opportunities and threats faced by the key vendors?
-What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Companies Mentioned in this Report: Amkor Technology, SUSS Microtek, EV Group, Tokyo Electron, ACCRETECH Tokyo Seimitsu, Rudolph Technologies, SEMES, Ultratech, ULVAC

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View this press release online at: http://rwire.com/707067