New Market Study, "Silicon on Insulator Market - Global Forecast to 2022", Has Been Published

Fast Market Research announces the availability of the new Markets and Markets report, "Silicon on Insulator Market - Global Forecast to 2022", on their comprehensive research portal

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Boston, MA -- (SBWire) -- 05/15/2017 --Silicon on Insulator Market by Wafer Size (200 mm, 300 mm), Wafer Type (RFSOI, FDSOI), Technology (BESOI, ELTRAN, SoS, SiMOX, Smart Cut), Product, Application (Automotive, Computing & Mobile, Entertainment & Gaming, Photonics) - Global Forecast to 2022

"SOI market expected to grow at a significant rate between 2017 and 2022"

The SOI market is expected to grow at a CAGR of 29.1% between 2017 and 2022, to reach USD 1,859.3 million by 2022. The key driving factors for the growth of the SOI market are the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices. However, the major restraints for the growth of this market are the lack of available IP ecosystem and the floating body effect.

Get More Details on this Report and a Full Table of Contents at Silicon on Insulator Market - Global Forecast to 2022

"200 mm SOI wafers expected to be the largest SOI wafer segment in 2017"

200 mm is currently the most popular SOI wafer size in the market. 200 mm is the diameter of the SOI wafer. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. In other words, almost all the smartphones make use of 200 mm SOI wafers. Soitec (France) is a leading player in the 200 mm market and holds more than 50% of the market share. Soitec has developed the smart cut technology, which is the major technology for manufacturing 200 mm SOI wafers.

"Smart cut technology expected to hold the largest share of the overall SOI market during the forecast period"

The smart cut technology is expected to hold the largest share of the overall SOI market between 2017 and 2022. Smart cut is Soitec's proprietary wafer bonding and layer splitting technology. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). This technology involves the implantation of light ions and wafer bonding for transferring ultrathin single-crystal layer from one substrate to another.

"APAC expected to be the fastest-growing region in the SOI market during the forecast period"

The SOI market in APAC is expected to grow at a high rate between 2017 and 2022. The high demand for smartphones and other consumer electronics devices is one of the major factors contributing to this high growth rate. In addition, the increasing popularity of 4G/LTE services and the future implementation of 5G architecture are helping the SOI market grow in this region. For example, China is expected to be the first country in the world to roll out 5G services by 2020.

The breakup of the profiles of primary participants for the report has been given below.

-By Company Type: Tier 1-55%, Tier 2-20%, and Tier 3-25%
-By Designation: C-Level Executives-50%, Directors-25%, and Others-25%
-By Region: Americas-60%, Europe-20%, APAC-10%, and RoW-10%

The key players operating in the SOI market are Soitec (France), Shin-Etsu (Japan), GlobalWafers (Taiwan), GlobalFoundries (U.S.), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Murata Manufacturing (Japan), Sony Corporation (Japan), MagnaChip Semiconductor (South Korea), TSMC (Taiwan), and Qualcomm (U.S.).

Research Coverage:

The research report on the SOI market covers different segments-wafer size, wafer type, technology, product, application, and geography. The market has been segmented on the basis of wafer size into 200 mm, 300 mm, and others. On the basis of wafer type, the market has been segmented into RFSOI, FDSOI, and others. The market on the basis of technology has been segmented into BESOI, ELTRAN, SoS, SiMOX, and smart cut. On the basis of product, the market has been classified into RF FE, MEMS, power, optical, and others. The SOI market has been segmented on the basis of application into automotive, computing and mobile, entertainment and gaming, photonics, telecommunications, and others. The report covers the market in four major regions-Americas, Europe, APAC, and RoW.

Key Benefits of Buying the Report:

Illustrative segmentation, analysis, and forecast for the market based on wafer size, wafer type, technology, product, application, and geography have been conducted to give an overall view of the SOI market.

The major drivers, restraints, opportunities, and challenges for the SOI market have been detailed in this report.

The report includes a detailed competitive landscape, along with an in-depth analysis and revenue of key players.

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