Recent research report, technology advancement and insights on "Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021"

Albany, NY -- (SBWire) -- 08/16/2017 --Fully depleted silicon-on-insulator (FD-SOI) is a planar process technology that provides an ideal platform for the development of planner transistor architecture on a SOI substrate. FD-SOI helps in delivering low power, improved performance, and reduced silicon geometries. The FD-SOI technology is based on two innovations: an ultra-thin insulator layer known as buried oxide, which is placed at the top of the silicon base, and a thin layer of silicon, which is used for creating a transistor channel. Owing to this thin layer, the doping of the channel is removed. This means that the impurity atoms that lie in the semiconductor are completely removed, making it fully depleted. The combination of these two innovations is called the ultra-thin body and buried oxide (UTBB)-FD-SOI technology. The FD-SOI structure has evolved from the bulk CMOS process. The FD-SOI technology helps in providing a balance between cost, digital performance, power consumption, and mixed-signal compatibility.

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The global fully depleted silicon-on-insulator (FD-SOI) technology market to grow at a CAGR of 43.37% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global fully depleted silicon-on-insulator (FD-SOI) technology market for 2017-2021. To calculate the market size, the report considers the revenue generated from FD-SOI technology.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

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Technavio's report, Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
GLOBALFOUNDRIES
SAMSUNG
STMicroelectronics
SOITEC
Other prominent vendors
Dream Chip Technologies
INVECAS
VERISILICON

Market driver
Smaller die sizes
For a full, detailed list, view our report

Market challenge
Challenges associated with 10-nm FD-SOI design
For a full, detailed list, view our report

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Market trend
Emergence of IoT
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?