The analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.

New York, NY -- (SBWire) -- 03/13/2018 --Global Semiconductor Chip Packaging Market

WiseGuyRerports.com Presents "Global Semiconductor Chip Packaging Market 2017-2021" New Document to its Studies Database. The Report Contain 70 Pages With Detailed Analysis.

Description

The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.

The analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.



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The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- ASM Pacific Technology
- Kulicke & Soffa Industries
- TEL
- Tokyo Seimitsu

Market driver
- Growing number of fabs
- For a full, detailed list, view our report

Market challenge
- Increasing complexity of semiconductor IC designs
- For a full, detailed list, view our report

Market trend
- Development of 3D chip packaging
- For a full, detailed list, view our report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Complete Report Details @ https://www.wiseguyreports.com/reports/895628-global-semiconductor-chip-packaging-market-2017-2021



Table of Contents -Major Key Points

PART 01: Executive summary

PART 02: Scope of the report
- Market overview
- Base year
- Market reportage
- Geographical coverage
- Vendor segmentation
- Common currency conversion rates
- Top-vendor offerings

PART 03: Market research methodology
- Research methodology
- Economic indicators

PART 04: Introduction
- Key market highlights

PART 05: Technology landscape
- Semiconductor IC manufacturing process
- WLP versus die-level packaging and assembly
- Roadmap of semiconductor packaging industry
- Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
- Market overview
- Market size and forecast
- Five forces analysis

PART 07: Market segmentation by OSATs and IDMs
- Global semiconductor chip packaging market by OSATs and IDMs
- OSATs
- IDMs

PART 08: Market segmentation by packaging techniques
- Flip-chip wafer bumping
- 2.5D interposers
- Fan-in WL CSP
- 3D WLP
- FO WLP/SiP
- 3D IC TSV stacks

PART 09: Geographical segmentation
- Market overview
- APAC
- Americas
- EMEA

PART 10: Key leading countries
- USA
- Taiwan

PART 11: Market drivers
- Growing number of fabs
- Increase in miniaturization of electronic devices
- High adoption of semiconductor ICs in automobiles
- Increase in number of fabless semiconductor companies

PART 12: Impact of drivers

PART 13: Market challenges
- High initial investment
- Increasing complexity of semiconductor IC designs
- Rapid technological changes

PART 14: Impact of drivers and challenges

PART 15: Market trends
- Development of 3D chip packaging
- Growing popularity of FOWLP technology
- Increase in wafer size

………..CONTINUED