Market Research Future published a research report on “3D IC Market Research Report- Global Forecast to 2022” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Pune, India -- (SBWire) -- 04/09/2018 --Market Highlights

The rise in demand by semiconductor industry for high density and bandwidth, and low power solution, many IC designers are looking up for 3D ICs mounted with through silicon vias (TSVs). 3D ICs accommodate with multiple heterogeneous die such as logic, memory, analog, RF, and micro-electrical mechanical systems thereby improve performance and reduce cost. 3D ICs offers following advantages over traditional system on chips (SoC): low cost, easier to meet high interconnect speeds & bandwidth requirements, ideal for compact mobile devices, reduced resistance-inductance-capacitance helps in reducing power, emerging technologies such as MEMS can potentially be integrated into 3D stacks. 3D ICs with TSVs is showing huge opportunity for semiconductor industry. It offers compelling power, performance and form factor advantages and also can curb the escalating cost of SoC development. However, a well-defined ecosystem including foundries, IP providers, and vendors, need to emerge with more innovative design kits and reference flows

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Although 3D ICs with TSVs do not require to adopt new 3D design system, but they are having some technical challenges such as development of cost-effective 3D processes and evaluation of various 3D platforms for a given application or a system. Because of the complex structure, fitting 3D ICs on a board is challenge for developers thereby requires a capable PCB layout system with appropriate analysis tools.

The 3D IC Market is growing rapidly over 17% of CAGR and is expected to reach at USD 10,470 million by the end of forecast period 2022. Growing increasing demand for advanced electronic products and high demand for 3D packaging using TSVs are the major factors driving the 3D ICs market.

Key Players:

Some of the major players in Global 3D IC Market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.

Segments for 3D IC Market:

Global 3D IC Market can be segmented as follows:

- Segmentation by Technology: type (3D stacked ICs and monolithic 3D ICs) and packaging & integration (3D system- in-package (Sip), 3D wafer level packaging (WLP), 2.5D & 3D interposing, and 3D heterogeneous integration.
- Segmentation by Components: through silicon vias (TSVs), through glass vias (TGVs), and others.
- Segmentation by Products: CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes.
- Segmentation by Application: IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.

Regional Analysis of 3D IC Market:

Asia-Pacific is dominating the Global 3D IC market with the largest market share due to emerging demand from growing consumer electronics market in the region and therefore is expected to grow with highest revenue by 2022. North-America is expected to grow as a second highest market after Asia-Pacific in the forecast period due to increasing demand of ICs in U.S. and Canada region.

Key Findings

- Globally 3D ICs market is expected to grow with 17% CAGR during 2016-2022.
- By type, 3D stacked IC is dominating the market whereas monolithic 3D IC is expected to be the fastest growing segment with approximately 20% CAGR during forecast period 2016-2022.
- Through silicon vias (TSVs) are projected to grow with approximately 19% CAGR
- Geographically, Asia-Pacific is dominating the 3D ICs market and expected to grow with 17% CAGR whereas North America is projected to be the fastest growing market

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Target Audience:

- Consumer electronics vendors
- Data center service providers
- Communication industries
- Research and consulting firms
- Small and large enterprises
- Government agencies

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