Thin Wafer Processing and Dicing Equipment Market - Global Industry Analysis, Trend, Size, Share and Forecast 2016 - 2024

Albany, NY -- (SBWire) -- 05/21/2018 --the global thin wafer processing and dicing equipment market, which was valued US$388.9 mn in 2015, is expected to rise at a CAGR of 6.80% during the period from 2016 to 2024 and increase to US$692.5 mn by the end of the forecast period. The conventional dicing technology, blade dicing, has been witnessing the most prominent demand across the world. Although this segment is expected to remain leading over the next few years, the laser dicing segment is likely to prove more lucrative for manufacturers in the near future.

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"The increasing demand for portable communication devices, such as memory cards, smartphones, smart card, and various computing devices is having a significant impact on the global market for thin wafer processing and dicing equipment," says an analyst at TMR. The surge in the uptake of thin wafers, in a bid to develop technologically advanced smart home devices and wearables, is stimulating the demand for thin wafer processing and dicing equipment across the world, reflecting greatly on this market.

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In addition, the increasing demand for three-dimensional integrated circuit (3D IC) is likely to add significantly to this growth over the forecast period. However, the high cost associated with the purchasing and maintenance of thin wafer processing and dicing equipment may hamper the market's progress in the near future, states the report.

Apart from this, the rising usage of thin wafer processing and dicing equipment in semiconductors is also anticipated to boost the Asia Pacific market in the years to come. Taiwan, China, and Japan are likely to lead this regional market in the near future, owing to the lucrative opportunities they provide to the manufacturers.