According to the report, global 3D IC market was valued at around USD 4.04 billion in 2016 and is expected to generate revenue of USD 10.90 billion by end of 2022, growing at a CAGR of slightly above 18.0% between 2017 and 2022.
Sarasota, FL -- (SBWIRE) -- 03/23/2017 -- Zion Market Research has published a new report titled "3D IC Market (LED, Memories, MEMS, Sensor, Logic and Others) by Substrate type (Silicon On Insulator and Bulk Silicon) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2016 – 2022". According to the report, global 3D IC market was valued at around USD 4.04 billion in 2016 and is expected to generate revenue of USD 10.90 billion by end of 2022, growing at a CAGR of slightly above 18.0% between 2017 and 2022.
Among different product, 3D IC market was dominated by memories and MEMS & sensor segment and is expected to retain its dominance in the global market over the estimated period. LED is another key outlet for this market and is expected to grow at a moderate rate due to rising adoption of LED products as it saves power consumption and provides efficiency.
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Based on application, the global 3D IC market is segmented into information and communication technology, military, consumer electronics and others. Information and communication technology segment held the largest market share for the 3D IC and accounted for around 26% market share of the total market in 2016. It is followed by consumer electronics and military segments. ICT is also expected to continue the trend in the next few years due to the high adoption rate of 3D IC integration technology. 3D IC market is segmented depending on the substrate used into silicon on insulator (SOI) and bulk silicon. Silicon on insulator (SOI) was the major segment of 3D IC and accounted for largest share of the global demand in 2016. Bulk silicon segment is expected to show moderate growth over the forecast period.
Demand for consumer electronics and ICT are expected to drive the 3D IC market over the forecast period. Furthermore, increasing number of portable devices such as smartphone, tablets or laptops are some of the major factors to drive adoption of 3D ICs. Growing high-end computing market and rising need of 3D ICs in industries such as military & aerospace, and servers & data centers sector are also driving the growth of 3D ICs market.
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Asia Pacific acquired a majority share of 3D IC market in 2016. It accounted for over 40% share of the entire market for 3D IC in the same year. Asia Pacific followed by, North America and Europe in terms of demand for 3D IC. North America is expected to witness strong growth during the forecast period. Asia Pacific is expected to continue its dominance in 3D IC market owing to significant demand from consumer electronics industries.
Browse the full "3D IC Market (LED, Memories, MEMS, Sensor, Logic and Others) by Substrate type (Silicon On Insulator and Bulk Silicon) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2016 – 2022" report at https://www.zionmarketresearch.com/report/3d-ic-market
Some of the key players in the global 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, United Microelectronics Corporation, STMicroelectronics and amongst others.
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