Sarasota, FL -- (SBWIRE) -- 07/12/2018 -- Zion Market Research has published a new report titled "3D Mobile Sensing Hardware Market by Type (External sensors and Built-in (Embedded and Internal)), by Product (MEMS, Pressure sensors, Microphones, and Environmental sensors), by Application (Consumer Electronics, Security & Surveillance, Healthcare, Entertainment, Aerospace & Defense, Automotive, Industrial Robotics, and Others): Global Industry Perspective, Comprehensive Analysis and Forecast, 2017– 2024". According to the report, the global 3D Mobile Sensing Hardware Market was valued at USD 1.38 billion in 2017 and is expected to reach USD 322.90 billion globally by 2024, growing at a CAGR of around 118% between 2018 and 2024.

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There has been an increasing application of sensor mobile phones or 3D mobile sensing systems and tablets across the globe. Sensors and MEMS are very important and popular component that enables many new features on mobile phones and tablets. Based on design and communication features, all mobile phone sensors are segmented into external sensors and built-in (embedded and internal). In 3D mobile sensing hardware market, 3D cameras anticipate being a game-changer in the forecast period.

The rising adoption of pressure sensors among consumers and the increasing sales of smartphones and tablets have accelerated the development of the global 3D mobile sensing hardware market. The booming Chinese smartphone markets and acceleration in the adoption of the internet of things (IoT) are also some of the factors propelling the growth of this market. Also, the rapid technological advancements are opening up a plethora of new applications across different industry verticals where 3D mobile sensing hardware can be used. Moreover, the focus on new product developments such as infra-red (IR) or multispectral imaging and gas sensors offers a potential opportunity to the market. However, the limitation in the adoption of 3D sensing technology and risk of commoditization is anticipated to hamper the demand for the market. Furthermore, the momentum of the market growth for 3D mobile sensing hardware will depend on component suppliers and smartphone makers. In addition, the development of third-party applications will be influential in raising the overall growth ratio of 3D mobile sensing hardware market.

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The global 3D mobile sensing hardware market is segmented on the basis of type, product, application, and regions. The type segment for 3D mobile sensing hardware market is bifurcated into external sensors and built-in (embedded and internal). Microphones, MEMS (microelectromechanical system) inertial sensors, pressure sensors, ALS (ambient light sensing), environmental sensors, fingerprint, and CMOS are some of the products of global 3D mobile sensing hardware market. The verticals of 3D mobile sensing hardware market are categorized into aerospace & defense, consumer electronics, security & surveillance, entertainment, healthcare, automotive, industrial robotics, and others. The regional segmentation comprises the current and forecast demand for the Middle East & Africa, North America, Asia Pacific, Latin America, and Europe for 3D mobile sensing hardware market with further country level bifurcation into the U.S., Canada, Mexico, UK, France, Germany, Poland, Russia, China, Japan, India, Brazil, and Argentina, among others.

Some of the key players in the 3D mobile sensing hardware market are TrendForce Corporation, Infineon Technologies, PMD Technologies, Qualcomm Technologies, Inc., Himax Technologies, Inc., AMS AG, Sunny Opotech Co., Ltd., Heptagon, Lumentum Operations LLC, Microsoft Corporation, Google LLC, Lenovo, Apple Inc., among others.

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The report segments the global 3D mobile sensing hardware market as follows:

Global 3D Mobile Sensing Hardware Market: By Type

External sensors
Built-in (Embedded, Internal)

Global 3D Mobile Sensing Hardware Market: By Product

MEMS (Microelectromechanical System)
Pressure Sensors
Microphones
Environmental Sensors
Fingerprint
ALS (Ambient Light Sensing)
CMOS
Others