Portland, OR -- (SBWIRE) -- 10/02/2017 -- Increase in trend of miniaturization in portable electronic industry and rise in dependency on these devices worldwide is shifting device manufacturers toward finding new methods of size reduction and overall efficiency enhancement of these devices, thus driving the growth of 3D semiconductor packaging market
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3D Semiconductor Packaging Market Report, published by Allied Market Research, forecasts that the global market is expected to garner $8.9 billion by 2022, registering a CAGR of 15.7% during the forecast period 2014-2022.In the year 2015, Asia-Pacific dominated the global market and contributed over 50% of the overall market and its anticipated to continue this trend during the forecast period.
Imminent requirement for size reduction in electronic devices, improved efficiency, and less power consumption drive the adoption of 3D semiconductor packaging in microelectronic devices and consequently navigates the growth in 3D semiconductor packaging industry. 3D semiconductor packaging technology provides improved performance of electrical devices operating at high frequencies, which increases its adoption in dynamic random access memory (DRAMS), NAND, and other high-end applications. It exhibits high speed and enhanced overall system efficiency while consuming smaller space as compared to its alternatives.
The 3D semiconductor packaging market trends which navigate unprecedented growth in 3D semiconductor packaging industry include, its advantages over other packaging technologies, lower cost, smaller size and enhanced efficiency. In 3D Through Silicon via (TSV) technology, the vertical connections are made through silicon die, and interconnect length is reduced drastically as compared to 2D technology where the connections are horizontal. The technological advantages of 3D packaging drive its demand in high-end applications such as chips used in super computers, DRAMS, NAND, microelectronic circuits, and others. Owing to these advantages, 3D semiconductor packaging market size has a lot of potential to rise with high growth rate. In 2015, US had the highest 3D semiconductor packaging market share in the overall North America 3D semiconductor packaging market, due to the high penetration of 3D TSV technology.
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The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.
KEY FINDINGS OF THE 3D SEMICONDUCTOR PACKAGING MARKET STUDY:
- 3D wire bonded dominated the market in 2015 with over 43% of market share, however, 3D TSV is expected to witness the highest growth rate of 17%
- In 2015, Bonding wire accounted for the second largest share in 3D semiconductor packaging technology segment although it will slowly be replaced by TSV technology in long run
- Die attach materials is estimated to be one of the fastest growing segment in coming years, growing at an estimated CAGR of 17.4%, owing to being a basic building block in several 3D packaging techniques
- Asia-Pacific dominated the market in 2015, countries such as China, South Korea and Japan supported the growth in the region