Albany, NY -- (SBWIRE) -- 03/23/2018 -- 3D XPoint, a memory storage technology jointly developed by Micron Technology Inc. and Intel The new technology is described as filling a gap between dynamic RAM (DRAM) and NAND flash. This technology innovation has an alternate plan structure which is speedier and more inflexible when contrasted with the NAND streak. Furthermore, it has the high stockpiling limit when contrasted with the customary memory stockpiling. The design process 3D XPoint technology is basic, based on mix of memory cell and selector which stores every single piece of the memory safely. It also diminishes the need of transistor amid the read and compose forms by keeping up the measure of voltage sent to its selector.

The 3D XPoint technology market is rebuilding the entire memory stockpiling market. The most imperative viewpoint which is driving the 3D XPoint technology market is the high level of execution and decreased dormancy when contrasted with DRAM and NAND. 3D XPoint, as contrast with NAND innovation are minimal effort and huge limit stockpiling. There are a few different viewpoints driving the worldwide 3D XPoint technology market, for example, superior, limit stockpiling, memory and perseverance at a sensible cost which are the key drivers for the innovations. The innovation helps in putting away vast volume of information using little space which brings about diminished expenses. The request of memory stockpiling innovation in electronic applications is persistently developing which is further driving the market of 3D Xpoint technology. It has application in the training, social insurance, car and retail applications as large number of memory stockpiling innovation applications are being received. Furthermore, 3D Xpoint technology market is seeing high interface restriction which is hampering the growth of the market.

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The global memory market is dominated by two technologies which are DRAM and NAND. However, as the technological landscape is changing, the level of competition is increasing rapidly. 3D XPoint technology is one such advanced technology for memory storage, representing the transformation of memory storage technology. The 3D XPoint technology helps in moving the data and trapping electrons in an efficient way. Bit storing is created when there is a bulk change, in combination with a stackable cross-gridded data access array. 3D XPoint technology is an effective alternative to both the present memory storage technologies which are DRAM and NAND. 3D XPoint technology is a hybrid memory technology which includes best offerings of flash memory. 3D XPoint technology has a different design structure which is faster and more rigid as compared to the NAND flash. Additionally, this technology has the high storage capacity as compared to the conventional memory storage.
The 3D XPoint technology market can be segmented by storage type, end users and geography. Based on storage type, the market for 3D XPoint technology market can be segmented into 1.5 TB, 750 GB, and others. By end users, the 3D XPoint technology market has been segmented into consumer, telecommunication, electronics, military and aerospace, retail, energy and power, automotive and transportation, agricultural, healthcare, and others. The consumer electronics industry is anticipated to observe an extensive growth due to 3D XPoint technology.

Geographically, 3D XPoint technology market is segmented into Europe, North America, Middle East and Africa, Asia Pacific, and South America. North America and Asia Pacific regions are expected to account for large market share in the 3D XPoint market. Particularly in the Asia Pacific region, countries such as China, Korea, India and Japan are driving the market. As these countries have the highest concentration of electronic equipment manufacturing organizations.

The major players in the 3D XPoint technology market include IM Flash (U.S), Intel Corporation (U.S), Micron Technology, Inc.(U.S), Numonyx B.V., Ltd, Samsung Group (South Korea)., SK Hynix, Inc. (South Korea), Western Digital Corp (U.S), SanDisk Corporation(U.S), Mushkin Inc.(U.S), Kingston, Qimonda, Faxtronics, Toshiba Corp. (Japan), among others.

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