The Insight Partners

At 25.7% CAGR, Redistribution Layer Material Market Will Reach USD 794.5 Million by 2027 Led by SK HYNIX, Amkor, ASE Group, Infineon, JCET, Dow Chemical, Toray

This report studies the Redistribution Layer Material Market status and outlook of Global and major regions from insights of players, countries, product types and end industries. The report provides detailed analyses of the driving forces and opportunities, major market segments, top investment industry trends, key player positioning, and competitive landscape. This report analyzes the top players in global market and splits the market by product type and applications/end user industries.


Pune, India -- (SBWIRE) -- 03/12/2019 -- The global Redistribution Layer Material Market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027 Driven by Key Players SK HYNIX, Amkor, ASE Group, Infineon, JCET, Dow Chemical, Toray, Sumitomo Bakelite, Shin-Etsu Chemical.

This report focuses on the Redistribution Layer Material Market Size, Revenue, Share, status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Redistribution Layer Material development in North Americas, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America (SA).

The major players operating in the market for Redistribution Layer Material Market include Advanced Semiconductor Engineering, Inc. (ASE group), Amkor Technology, Inc., Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems L.L.C., Infineon Technologies AG, and Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET). Also, NXP Semiconductors N.V., Samsung Electronics Co. Ltd, Shin-Etsu Chemical Co., Ltd., SK HYNIX INC., Sumitomo Bakelite Co., Ltd, The Dow Chemical Company, and Toray Industries, Inc. are some other prominent players operating in the redistribution layer material market.

Semiconductor fabrications are resulting in the rising levels of automation in the manufacturing sector worldwide. As a result, it is being said that the demand for billions of things to get connected over the internet will ripple through the entire value chain, from software and services until the semiconductor devices. With the ongoing pace of IoT emergence and deployments across the globe, semiconductor industry is expected to play a key role and thus benefit from innovations across the technology value chain. As the cloud economy becomes mainstream in the IoT era, semiconductor companies need to continuously innovate to drive connectivity across the IoT value chain.

Additionally, IoT-connected products and applications would require chips with an ultra-small form factor, low power consumption and wireless connectivity options. With the increased adoption of IoT sensor products like smart watches and glasses, as well as smartphones and other wearable devices, the semiconductor industry drives Micro electro mechanical (MEMS) sensor platforms with the power advantages of lower technology nodes and increased functionality on a single small form-factor die.

Get Sample PDF Brochure of this research at

Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones.

Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material and therefore, these manufacturing sectors are anticipated to drive the demands for redistribution layer material drastically during the forecast period. The global redistribution layer material market is estimated to rise to US$ 794.5 Mn by the year 2027 from US$ 105.4 Mn in the year 2018, growing at a CAGR of 25.7% during the forecast period 2019-2027.

The redistribution layer material market has been derived from market trends and revenue generation factors from four different regions across the globe namely; North America, Europe, Asia Pacific, Rest of the world. APAC is expected to be the fastest growing region in the usage of redistribution layer materials. The major reason for this is the presence of large semiconductor manufacturing hub in the region. Taiwan, China, South Korea, Vietnam are some of the important countries in Asia that comprise of large semiconductor manufacturing units. Also, inexpensive labor, skilled professionals, and lesser cost of raw materials in this region is another factor driving the growth of semiconductor industry in Asia and in turn favoring the growth of RDL materials market in the region.

Geographically, Asia Pacific will have the largest share in the Redistribution Layer Material market by 2027, owing to rapid technological developments, numerous investments and supportive Government policies for the semiconductor industry in South East Asian countries.

Samsung Electronics Co. Ltd, The Dow Chemical Company, NXP Semiconductors N.V., and Advanced Semiconductor Engineering, Inc. (ASE group) – NOTABLE MARKET PARTICIPANTS IN REDISTRIBUTION LAYER MATERIAL INDUSTRY

The redistribution layer material market is highly competitive in nature with considerable number of players, having a high level of dominance over the overall revenue share. Most of the companies operating in the redistribution layer material market are present globally and have wide distribution and sales network through partnerships or authorized dealers.
The most notable market participants are Samsung Electronics Co. Ltd, The Dow Chemical Company, NXP Semiconductors N.V., and Advanced Semiconductor Engineering, Inc. (ASE group), Infineon Technologies AG, and Amkor Technology, Inc. for a considerable share of the market owing to their product offerings to the market.

Market leaders are involved in mergers and acquisitions of smaller market players. Many well-known redistribution layer material providers are present in the market to provide various innovative dielectric materials to its customers. The larger firms are adopting the strategy of acquiring and collaborating with various companies to enhance its capabilities and expand its footprint in different geographies. This type of strategy allow the companies to strengthen its footprint in the market and also its brand name. For instance, Amkor Technology, Inc. acquired NANIUM S.A. This strategic acquisition will enhance Amkor's position as one of the leading providers of WLP and WLFO packaging solutions. Moreover, Building on NANIUM's proven technologies, the company can expand the manufacturing scale and broaden the customer base for this technology.

Directly Purchase/Place an Order for a copy of this research report at

The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT.

The number of mobile subscriptions exceeds the population in many countries, which is largely due to inactive subscriptions, multiple device ownership or optimization of subscriptions for different types of calls. As a result, the number of subscribers is lower than the number of subscriptions. Today, there are around 5.3 billion subscribers globally compared to 7.9 billion subscriptions. Also, 98 million new mobile subscriptions was observed globally in first quarter of 2018. Huge populations of India and China are further proliferating the growing penetration of smart phones and other consumer electronic devices. Additionally, the Government initiatives towards digitalization of economies in these countries is leading to exponential growth of data traffic over the internet in these countries and also on a global scale for other developing economies. Brazil, Uruguay, Argentina, Chile, Colombia, UAE, Saudi Arabia, South Africa, Vietnam and Singapore are other major countries embracing the path of digitalization and resulting in huge influx of data over the internet.

The overall redistribution layer material market size has been derived using both primary and secondary source. The research process begins with exhaustive secondary research using internal and external sources to obtain qualitative and quantitative information related to the redistribution layer material market. It also provides the overview and forecast for the global redistribution layer material market based on all the segmentation provided with respect to five major reasons such as North America, Europe, Asia-Pacific, Rest of World (RoW). Also, primary interviews were conducted with industry participants and commentators in order to validate data and analysis. The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers, and external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the Redistribution Layer Material industry.

The report segments the global redistribution layer material market as follows:

1.1.1 Global Redistribution Layer Material Market – By Material
- Polyimide (PI)
- Polybenzoxazole (PBO)
- Benzocylobutene (BCB)
- Others

1.1.2 Global Redistribution Layer Material Market – By Application
- 2.5D/3D IC Packaging Global Redistribution Layer Material Market – By 2.5D/3D IC Packaging
- High Bandwidth Memory (HBM)
- Multi-Chip Integration
- Package on Package (FOPOP)
- Others

1.1.3 Global Redistribution Layer Material Market – By Geography
- North America
o U.S.
o Rest of North America

- Europe
o Portugal
o Germany
o UK
o Rest of Europe

- Asia Pacific (APAC)
o Taiwan
o China
o South Korea
o Japan
o Rest of APAC

- Rest of World (RoW)

Key Benefits of Buying this Research Study:
1. Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the global Redistribution Layer Material market
2. Highlights key business priorities in order to assist companies to realign their business strategies
3. The key findings and recommendations highlight crucial progressive industry trends in the Redistribution Layer Material market, thereby allowing players across the value chain to develop effective long term strategies
4. Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
5. Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it
6. Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution
7. Examine the political, economic, social and technology impact of the five regions namely: North America, Europe, Asia Pacific, Middle East & Africa and South America.

About The Insight Partners
The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We are a specialist in Technology, Healthcare, Manufacturing, Automotive and Defense.