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Bonding Wire Packaging Material Market Research, Key Manufacturers and Forecast 2025

Bonding Wire Packaging Material Market-New Research Report Announced with business priorities in order to assist companies to realign their business strategies.


City of Industry, CA -- (SBWIRE) -- 07/13/2018 -- This report studies the Bonding Wire Packaging Material market size (value and volume) by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades.

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One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer's requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.

An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period.

The global market for Bonding Wire Packaging Material was dominated by APAC and it accounted for a significant share of the total market. This dominance of APAC is the likely result of the presence of several semiconductor manufacturing giants in this part of the world. Moreover, factors such as the use of alternative materials for packaging and technological advancements will play a crucial role in the growth of this region during the forecasted period.

The global Bonding Wire Packaging Material market was xx million US$ in 2017 and is expected to xx million US$ by the end of 2025, growing at a CAGR of xx% between 2018 and 2025.

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Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Bonding Wire Packaging Material in these regions, from 2013 to 2025, covering

North America (United States, Canada and Mexico)

Europe (Germany, UK, France, Italy, Russia and Turkey etc.)

Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)

South America (Brazil etc.)

Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

Alpha Packaging

APEX Plastics


TANAKA Precious Metals

Heraeus Deutschland

California Fine Wire

MK Electron




Palomar Technologies

Sumitomo Metal Mining

Tatsuta Electric Wire & Cable

By the product type, the market is primarily split into


Palladium-Coated Copper (PCC)



By the end users/application, this report covers the following segments