Albany, NY -- (SBWIRE) -- 09/14/2015 -- About organic substrate packaging materials

The global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

Download Sample Copy of this Report at http://www.marketresearchreports.biz/sample/sample/357237

Covered in this report

This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:

Packaging technology Geography

Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

Explore All Packaging Market Research Reports at http://www.marketresearchreports.biz/tag/Packaging

Key regions:
APAC
Europe
North America
ROW

Key vendors:
AJINOMOTO
AMKOR
ASE Kaohsiung
Mitsubishi Gas Chemical
SPIL
STATS ChipPAC

Market driver:
Demand for wireless devices
For a full, detailed list, view our report

Market challenge:
Dependency on semiconductor equipment industry performance
For a full, detailed list, view our report

Market trend:
Popularity of redistributed chip packaging
For a full, detailed list, view our report

Key questions answered in this report:
What will the market size be in 2019 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

Related Reports:
Japan Packaging Coatings Industry 2015
Global Packaging Coatings Industry 2015
United States Flexible Plastic Packaging Industry 2015

Contacts:
MarketResearchReports.biz
Nachiket Ghumare, +1-518-621-2074
USA-Canada Toll Free: 866-997-4948
sales@marketresearchreports.biz
http://www.marketresearchreports.biz