Transparency Market Research

Die-Attach Materials Market - Semiconductor Industry Opens Up Growth Avenues in Market


Albany, NY -- (SBWIRE) -- 05/21/2018 -- Noteworthy vendors in the global market for die-attach materials that are impacting its competitive contours big time are Dow Corning Corporation, Creative Materials Inc., Henkel, Master Bond Inc., AI Technology, Alpha Assembly Solutions, and Hybond Inc. They are seen heavily investing in development of cutting-edge production techniques that would bring down overall manufacturing costs.

Transparency Market Research in one of its recent research study on the die-attach materials market finds that it would rise steadily at a 3.1% CAGR over the course of the forecast period starting from 2017 and ending in 2026. At this rate, it projects the market to reach a value of US$970 mn by the end of 2026.

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Depending upon the form of die-attach materials, the paste-based ones will likely see soaring uptake in the next couple of years. Geography-wise, Asia-Pacific excluding Japan (APEJ) accounts for the biggest market share. In the years ahead too, the region is predicted to retain its dominant share. In fact, the region powered by China and South Korea, which are major producers of die-attach materials, is expected to mainly impact the trajectory of the market. The TMR report predicts the region to generate about 70% of the revenue in the overall die-attach materials market by 2026-end.

Semiconductor Industry Opens up Growth Avenues in Market

At the forefront of driving the market for die-attach materials is the spiking demand for consumer electronics. Die-attach materials are an integral part of the electrical circuit boards used in such consumer electronics. Elaborating it, the lead analyst of the TMR report adds, "The progressing semiconductor industry has generated new areas for usage of electronic components in a wide variety of devices. With growing usage of electronic chips and chipsets, die-attach materials are seeing a massive rise in demand. High thermal conductivity, low-temperature sintering, high electrical conductivity, and low costs are main factor driving sales of die-attach materials worldwide."

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Difficulties in Expanding Facilities Deters Growth

Despite such a promising outlook, the market for die-attach material is running into headwinds on account of difficulties in expanding their production facilities. This is mainly because of the manufacture of die-attach materials is getting complicated by the day with suppliers unable to procure raw materials in a cost-effective manner.

However, the massive demand for consumer goods in Asia Pacific excluding Japan and Japan will continue driving the global die-attach materials market in the near future. The different types of die-attach materials available in the market are films, adhesives, solder, and sintering. Of them, the films are primarily responsible for revenue growth. This is mainly because of their growing applications in a range of areas.