New York, NY -- (SBWIRE) -- 04/17/2017 -- The analysts forecast the global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.

Die bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step. bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.

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Covered in this report

The report covers the present scenario and the growth prospects of the global die bonder equipment market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies

Other prominent vendors
- Besi
- DIAS Automation
- Hesse
- Hybond
- SHINKAWA
- Toray Engineering
- West-Bond

Market driver
- Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
- For a full, detailed list, view our report

Market challenge
- High demand for polymer adhesive wafer bonding equipment.
- For a full, detailed list, view our report

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Market trend
- Increase in M&A in the semiconductor packaging and assembly market.
- For a full, detailed list, view our report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Table Of Contents – Major Key Points

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology
PART 04: Introduction
- Key market highlights

PART 05: Market landscape
- Overview of semiconductor packaging and assembly equipment
- Ecosystem of semiconductor IC packaging industry
- Market overview
- Market size and forecast
- Five forces analysis

PART 06: Market segmentation by end-user
- Market overview
- OSATs
- IDMs
PART 07: Geographical segmentation
- Die bonder equipment market in APAC
- Die bonder equipment market in Americas
- Die bonder equipment market in EMEA

PART 08: Key leading countries
- Taiwan
- South Korea
- Japan
- China

PART 09: Decision framework

PART 10: Drivers and challenges
- Market drivers
- Impact of drivers on key customer segments
- Market challenges
- Impact of challenges on key customer segments

PART 11: Market trends
- Growing use of 3D chip packaging
- Increase in number of OSAT vendors
- Increase in M&A in the semiconductor packaging and assembly market
- Advent of FOWLP technology
- Automation in automobiles

PART 12: Vendor landscape
- Competitive scenario
- Major vendors
- Other prominent vendors

Continued…….

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