Los Angeles, CA -- (SBWIRE) -- 03/14/2019 -- ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
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Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
The global Die-level Packaging Equipment market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Die-level Packaging Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Die-level Packaging Equipment market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
ASM International
BE Semiconductor Industries
DISCO
Kulicke & Soffa Industries
Advantest
Cohu
Hitachi High-Technologies
Shinkawa
TOWA
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Segment by Regions
North America
Europe
China
Japan
Segment by Type
Wafer-level packaging
Die-level packaging
Segment by Application
Solder Paste
Automated Component Pick and Place
Reflow
Flux Cleaning
Underfill
Rework
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