Global Electronic Goods Packaging Market Information Report By Material (Corrugated Boxes, Foamed Plastic, Paperboard, Bubble Packaging, Others), By Product Size (Small Appliances, Large Appliances), By Technology (Authentication Packaging, Track And Trace Packaging) And By Region - Global Forecast To 2023
Pune, India -- (SBWIRE) -- 06/19/2017 -- Market Research Future published a half cooked research report on Global Electronic goods packaging market. The Electronic goods packaging market is expected to grow over the CAGR of around 5 % during the period 2017 to 2023.
The electronic goods packaging market is majorly driven by the increased need of packaging the electronic products basically for preventing them from the external damages. The boom in the e-commerce industry especially for electronic goods is also driving the growth of the electronic goods packaging market. The increase in internet based shopping and the app based shopping is also contributing to the growth of the electronic goods packaging market. However, the increase in the pressure for prices of the products is hindering the growth of the market.
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Key Players of Electronic Goods Packaging Market:
-DS Smith Plc. (U.K.)
-International Paper Company (U.S.)
-Mondi plc. (Austria)
-Sealed Air Corporation (U.S.)
-Smurfit Kappa (Republic of Ireland)
-Dunapack Packaging (Austria)
-Georgia-Pacific LLC (U.S.)
-Graham Packaging (U.S.)
-Pregis LLC (U.S.)
-Sonoco Products Company (U.S.)
-Stora Enso (Finland)
Market Research Analysis:
The Asia-Pacific region is expected to grow the highest in the Electronic goods packaging market owing to the availability of low cost labor in the region. The rapid advancements in the industrial sector of the region is leading to an increased production of all kinds of electronic goods, thereby leading to an increase in demand for electronic goods packaging market. The large scope of FDI in the emerging economies of the region such as India and China is also contributing to the growth of the electronics industry thereby driving the need of the electronics goods packaging industry.
Scope of the Report:
This study provides an overview of the global Electronic goods packaging market, tracking three market segments across four geographic regions. The report studies key players, providing a five-year annual trend analysis that highlights market size, volume and share for North America, Europe, Asia Pacific (APAC) and Rest of the World (ROW). The report also provides a forecast, focusing on the market opportunities for the next five years for each region. The scope of the study segments the global Electronic goods packaging market by its material, product size, technology and region.
By product size
-Track and trace packaging
-Rest of the World
1 Executive Summary
2 Research Methodology
2.1 Scope of the Study
2.1.2 Research Objective
2.2 Research Process
2.2.1 Primary Research
2.2.2 Secondary Research
2.3 Market size Estimation
2.4 Forecast Model
3 Market Dynamics
3.1 Market Drivers
3.2 Market Inhibitors
3.3 Supply/Value Chain Analysis
3.4 Porter's Five Forces Analysis
4 Global Electronic goods packaging market, By Material
4.1 Corrugated boxes
4.2 Foamed plastic
4.4 Bubble packaging
5 Global Electronic goods packaging market, By Product size
5.1 Small appliances
5.2 Large appliances
Report Details @ https://www.marketresearchfuture.com/reports/electronic-goods-packaging-market-3118
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