Los Angeles, CA -- (SBWIRE) -- 04/30/2019 -- Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
At present, in the foreign industrial developed countries the Electronic Potting & Encapsulating industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the Europe and USA. Meanwhile, foreign companies have more mature equipment, strong R & D capability, and the technical level is also in a leading position. But in foreign companies the manufacturing cost is relatively high, compared with in China. So the manufacturing cost in developed countries is a disadvantage. As the production technology of Electronic Potting & Encapsulating manufacturers in China continues to improve, the share of Chinese manufactures will be increasing, and the competitiveness in the international market will also gradually increase.
Currently China has become international Electronic Potting & Encapsulating large consumption country, but the production technology is relatively laggard, the manufacturers can only produce some low-end product, although after 2010 the new production lines is expanding, the technology is still relying on import.
The Electronic Potting & Encapsulating is mainly used in the electronics industry. As the electronics industry develops, there is a growing demand to increase the package performance. Along with this, performance and quality requirements for Electronic Potting & Encapsulatings have become more demanding.
The global Electronic Potting & Encapsulating market was 1170 million US$ in 2018 and is expected to 2740 million US$ by the end of 2025, growing at a CAGR of 11.2% between 2019 and 2025.
This report studies the Electronic Potting & Encapsulating market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
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Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Electronic Potting & Encapsulating in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
By the product type, the market is primarily split into
Silicones
Epoxy
Polyurethane
Others
By the end users/application, this report covers the following segments
Consumer Electronics
Automotive
Medical
Telecommunications
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