Electrostatic Chucks for Wafer Market Report contains a complete product overview and its scope in the market to define the key terms and provide the clients a holistic idea of the market and its tendency.
Los Angeles, CA -- (SBWIRE) -- 02/13/2019 -- The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
The global Electrostatic Chucks for Wafer market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Electrostatic Chucks for Wafer volume and value at global level, regional level and company level. From a global perspective, this report represents overall Electrostatic Chucks for Wafer market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
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The following manufacturers are covered:
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Others
Segment by Regions
North America
Europe
China
Japan
Segment by Type
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks
Segment by Application
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
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