Albany, NY -- (SBWIRE) -- 04/27/2016 -- Failure analysis is an engineering approach to determine how and why equipment or a component is not functioning in a desired manner. The goal here is to understand the root cause of the failure so as to prevent similar incidences in the future. Generally, failures are caused due to manufacturing defects, misuse or abuse, improper maintenance, assembly errors, design errors, improper material, fastener failure, unforeseen operating conditions, inadequate quality assurance, improper heat treatments, inadequate environmental protection\\control, and casting discontinuities.

This market research study analyzes the failure analysis equipment market in the semiconductor industry on a global level, and provides estimates in terms of revenue (USD billion) from 2014 to 2020. The study identifies the drivers and restraints affecting the industry and analyzes their impact over the forecast period. Moreover, it highlights the significant opportunities for market growth in the coming years.

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The report segments the market on the basis of geography into North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW), estimated in terms of revenue (USD billion). In addition, the report segments the market based on equipment which includes Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam (FIB) Systems, and Dual Beam (FIB/SEM) Systems. The report has also segmented the market based on technology which include Focused Ion Beam (FIB), Transmission Electron Microscopy, Broad Ion Milling (BIM), Scanning Electron Microscopy, Scanning Transmission Electron Microscopy (STEM), Secondary Ion Mass Spectroscopy (SIMS), X-ray imaging, Energy Dispersive X-ray Spectroscopy (EDX), Nanoprobing, Laser Voltage Imaging (LVI), Reactive Ion Etching (RIE) and Chemical Mechanical Planarization (CMP).

Additionally, the report segments the market based on applications into defect localization, defect characterization and other applications. On the basis of customers, the market has been segmented into fab FA labs, fabless FA labs, specialty labs and other types of labs/customers. All these segments have been estimated on the basis of geography in terms of revenue (USD billion).

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A detailed analysis of the value chain offers a better understanding of the failure analysis equipment market in the semiconductor industry. Porter's five forces analysis throws light on the intensity of competition present in the market. Furthermore, the study comprises a market attractiveness analysis, where the equipment are benchmarked based on their market scope, growth rate and general attractiveness.

The report provides company market share analysis of the various industry participants. Major players have also been profiled on key points such as company overview, financial overview, product portfolio, business strategies, SWOT analysis, and recent developments in the field of failure analysis equipment in the semiconductor industry. Major market participants profiled in this report include FEI, Hitachi High-Technologies Corporation, Carl Zeiss SMT GmbH, and JEOL Ltd.

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