Edison, NJ -- (SBWIRE) -- 04/23/2019 -- Flip Chip, also known as direct chip attach, is a process which interconnects chip and package carriers or substrate using a conductive bump. Once the die is connected the stand-off distance between the die and substrate is typically filled with a non-conductive adhesive referred to as underfill.

Advance Market Analytics recently introduced Global Flip Chip Market study with in-depth overview, describing about the Product / Industry Scope and elaborates market outlook and status to 2025. Flip Chip Market explores effective study on varied sections of Industry like opportunities, size, growth, technology, demand and trend of high leading players. It also provides market key statistics on the status of manufacturers, a valuable source of guidance, direction for companies and individuals interested in the industry.

According to AMA, the market for Flip Chip is expected to register a CAGR of 6.41% during the forecast period to 2024.

Major Key Players in This Report Include,

ASE Technology Holding Co. Ltd. (Taiwan), Amkor Technology Inc. (United States), Intel Corporation (United States), Powertech Technology (Taiwan), Jiangsu Changjiang Electronics Technology Co. Ltd (China), Samsung Group (South Korea), Taiwan Semiconductor Manufacturing (Taiwan), Global Foundries (United States), STMicroelectronics (Switzerland), Flip Chip International (United States) and Texas Instruments (United States) etc

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Market Drivers
Increasing Demand for Miniaturization and High-Performing Electronic Devices

Market Trend
Decreasing Size of Smartphones and Portable Devices

Restraints
Huge Initial Investment Required for Setting up New Manufacturing Facility

Opportunities
Increasing Growth of the IC Industry

Challenges
High Cost Associated With Flip Chip Packaging Solutions

This market research report looks into and analyzes the Global Flip Chip Market and illustrates a comprehensive evaluation of its evolution and its specifications. Another aspect that was considered is the cost analysis of the main products dominant in the Global Market considering the profit margin of the manufacturers.

This research is categorized differently considering the various aspects of this market. It also evaluates the current situation and the future of the market by using the forecast horizon. The forecast is analyzed based on the volume and revenue of this market. The tools used for analyzing the Global Flip Chip Market research report include SWOT analysis.

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The titled segments and Market Data Break Down are illuminated below:
The Study Explore the Product Types of Flip Chip Market: Memory, High Brightness, Light-Emitting Diode (LED), RF, Power and Analog ICs, Imaging, 2D Logic Soc

Key Applications/end-users of Global Flip Chip Market: Medical Devices, Industrial Applications, Automotive, Aerospace & Defence, Telecommunication, Electronic Devices, Others

Bumping Technology: Copper Pilar, Gold Bumping, Silver Bumping, Other

Packaging Technology: 2D IC, 2.5D IC, 3D IC

Top Players in the Market are: ASE Technology Holding Co. Ltd. (Taiwan), Amkor Technology Inc. (United States), Intel Corporation (United States), Powertech Technology (Taiwan), Jiangsu Changjiang Electronics Technology Co. Ltd (China), Samsung Group (South Korea), Taiwan Semiconductor Manufacturing (Taiwan), Global Foundries (United States), STMicroelectronics (Switzerland), Flip Chip International (United States) and Texas Instruments (United States) etc

List of players also available in Coverage: Palomar Technologies Inc. (United States) , United Microelectronics (Taiwan) , Nepes (South Korea)

The regional analysis of Global Flip Chip Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and Rest of the World. North America is the leading region across the world. Whereas, owing to rising no. of research activities in countries such as China, India, and Japan, Asia Pacific region is also expected to exhibit higher growth rate the forecast period 2019-2025.

The Global Flip Chip Market in terms of investment potential in various segments of the market and illustrate the feasibility of explaining the feasibility of a new project to be successful in the near future. The core segmentation of the global market is based on product types, SMEs and large corporations. The report also collects data for each major player in the market based on current company profiles, gross margins, sales prices, sales revenue, sales volume, photos, product specifications and up-to-date contact information.

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Strategic Points Covered in Table of Content of Global Flip Chip Market:
Chapter 1: Introduction, market driving force product Objective of Study and Research Scope the Flip Chip market
Chapter 2: Exclusive Summary – the basic information of the Flip Chip Market.
Chapter 3: Displaying the Market Dynamics- Drivers, Trends and Challenges of the Flip Chip
Chapter 4: Presenting the Flip Chip Market Factor Analysis Porters Five Forces, Supply/Value Chain, PESTEL analysis, Market Entropy, Patent/Trademark Analysis.
Chapter 5: Displaying the by Type, End User and Region 2013-2018
Chapter 6: Evaluating the leading manufacturers of the Flip Chip market which consists of its Competitive Landscape, Peer Group Analysis, BCG Matrix & Company Profile
Chapter 7: To evaluate the market by segments, by countries and by manufacturers with revenue share and sales by key countries in these various regions.
Chapter 8 & 9: Displaying the Appendix, Methodology and Data Source

Finally, Flip Chip Market is a valuable source of guidance for individuals and companies.

Data Sources & Methodology

The primary sources involves the industry experts from the Global Flip Chip Market including the management organizations, processing organizations, analytics service providers of the industry's value chain. All primary sources were interviewed to gather and authenticate qualitative & quantitative information and determine the future prospects.

In the extensive primary research process undertaken for this study, the primary sources – Postal Surveys, telephone, Online & Face-to-Face Survey were considered to obtain and verify both qualitative and quantitative aspects of this research study. When it comes to secondary sources Company's Annual reports, press Releases, Websites, Investor Presentation, Conference Call transcripts, Webinar, Journals, Regulators, National Customs and Industry Associations were given primary weight-age.

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