Naperville, IL -- (SBWIRE) -- 10/09/2014 -- Reportstack, provider of premium market research reports announces the addition of Global 3D IC Market 2014-2018 market report to its offering

About 3D IC

A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.

Analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.

Covered in this Report:

This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology. The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market.

Key Regions:

- Americas
- APAC
- EMEA

Key Vendors:

- Advanced Semiconductor Engineering
- Samsung Electronics
- STMicroelectronics
- Taiwan Semiconductor Manufacturing

Other Prominent Vendors:

- 3M Company
- IBM
- Micron Technology
- STATS ChipPAC
- United Microelectronics
- Xilinx

 Market Driver:

- Huge Demand for Memory-enhanced Applications
- For a full, detailed list, view our report

Market Challenge:

- Thermal Conductivity Issues
- For a full, detailed list, view our report

Market Trend:

- Multi-chip Packaging
- For a full, detailed list, view our report

Key Questions Answered in this Report:

- What will the market size be in 2018 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Complete report is available
http://www.reportstack.com/product/175672/global-3d-ic-market-2014-2018.html

Contact:
Roger Campbell
roger@reportstack.com
Naperville
Illinois
United States
Ph: 888-789-6604