Global 3D ICs Market - Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 – 2019
Albany, NY -- (SBWIRE) -- 06/02/2015 -- As per a recent market study published by Transparency Market Research (TMR), the global 3D ICs market will be worth US$7.52 billion by 2019. TMR, a market intelligence company based in the U.S., concludes that the global 3D ICs market will demonstrate strong progress at an 18.1% CAGR between 2013 and 2019 to grow from US$2.4 billion in 2012. The report, titled "Global 3D ICs Market - Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019", is available on the company website for sale.As per TMR's findings, the exorbitant demand for electronic products that work at exceptionally fast speeds and consume less power, lower response times, and small chip size will serve as key drivers for the growth of the 3D ICs market. Additionally, 3D IC technology is witnessing progressive growth due to issues associated with limited communications capacity, chip signaling, and memory latency.
Browse the full Global 3D ICs Market report at http://www.transparencymarketresearch.com/3d-ics-market.html
Also, rising demand for memory-enhanced solutions is contributing significantly to the growth of the 3D ICs market, as per the TMR study. On top of this, increased use of handheld devices such as tablet and smartphones and demand for improved performance solutions is driving the use of 3D ICs. As per the report, industries closely related with 3D ICs, such as consumer electronics and information and communication technology (ICT), will have a profound impact on the 3D ICs market worldwide. Other end-use industries such as biomedical, transport, military, and R&D industries will also exhibit substantial demand for 3D ICs during the forecast period.However, high cost of production and testing, insulation and testing issues, and inadequate foundries and assembly houses to support the technology are some challenges limiting the growth of the 3D ICs market worldwide.
For the purpose of the study, TMR segments the global 3D ICs market on the basis of end users, substrate type, fabrication process, products, and geography. As analyzed by TMR, several industry products such as RF SiP, memories (3D Stacks), optoelectronics and imaging, MEMS and sensors, HB LED, and logic (3D SiP/SoC) are expected to grow in stature in the 3D IC market. Of all, MEMS and sensors and memories are anticipated to dominate the market in the coming years. The rising popularity of memory-enhanced solutions will drive the demand for the memory (3D stacks) segment, as forecast by TMR. Further, the study finds that in 2012, a large chunk of the 3D ICs market revenue –close to 24.2% – was generated by the ICT industry. The benefits of 3D ICs with respect to bandwidth capabilities and enhanced storage capacity for high rendition networking devices will help demand for the devices from the ICT industry.
Browse the full Global 3D ICs Market Press Release report at
According to geographical distribution, Asia Pacific will emerge as the largest market for 3D ICs owing to the growth brought about by its flourishing ICT and consumer electronics industries. Asia Pacific will account for the largest market share of the 3D ICs market, followed by North America.
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Transparency Market Research (TMR) is a global market intelligence company providing business information reports and services. The company's exclusive blend of quantitative forecasting and trend analysis provides forward-looking insight for thousands of decision makers. TMR's experienced team of analysts, researchers, and consultants use proprietary data sources and various tools and techniques to gather and analyze information.
TMR's data repository is continuously updated and revised by a team of research experts so that it always reflects the latest trends and information. With extensive research and analysis capabilities, Transparency Market Research employs rigorous primary and secondary research techniques to develop distinctive data sets and research material for business reports.
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