Global Bonding Wire Packaging Material Market Will Generate Revenues of USD 2.9 Billion in 2020

The Report Global Bonding Wire packaging material market 2016-2020 provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. -


Albany, NY -- (SBWIRE) -- 07/06/2016 -- About the Bonding Wire Packaging Material Market

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.

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Technavios analysts forecast the Global Bonding Wire Packaging Material Market will generate revenues of USD 2.9 billion in 2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.

The market is divided into the following segments based on geography:

North America

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Technavio's report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
TANAKA Precious Metals
Heraeus Deutschland
California Fine Wire
MK Electron

Other prominent vendors
Palomar Technologies
RED Micro Wire
Sumitomo Metal Mining
Tatsuta Electric Wire & Cable

Market driver
Rising need for miniaturization
For a full, detailed list, view our report

Market challenge
Migration to flip chip packaging technology
For a full, detailed list, view our report

Market trend
Migration to smaller diameter wires
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

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