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Global Semiconductor Chip Packaging Market to Grow at a CAGR of 31.1% During the Period 2017-2021; Finds New Report

Market Research Reports, Inc. has announced the addition of “Global Semiconductor Chip Packaging Market 2017 - 2021” research report to their website


Lewes, DE -- (SBWIRE) -- 03/20/2017 -- Report forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.

The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.

The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.

The market is divided into the following segments based on geography:
- Americas

According to the report, the demand for semiconductor chips and memory devices from consumer electronics is increasing due to the growing popularity of IoT-connected devices. Due to its cyclical nature, the semiconductor industry slowed down in 2016. The Chinese economy is also growing at a sluggish rate.

Further, the report states that the growing functionalities of consumer electronic devices have led to increased demand for multifunctional ICs. This has propelled semiconductor manufacturers to develop new and more complex architecture and design of semiconductor ICs. Based on these designs, the manufacturing process of semiconductor ICs is getting complex. This has created the demand for more sophisticated WLP solutions in the market.

Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

key players in the global semiconductor chip packaging market: Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL, and Tokyo Seimitsu

Market driver
- Growing number of fabs
- For a full, detailed list, view our report

Market challenge
- Increasing complexity of semiconductor IC designs
- For a full, detailed list, view our report

Market trend
- Development of 3D chip packaging
- For a full, detailed list, view our report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Spanning over 70 pages and 34 Exhibits "Global Semiconductor Chip Packaging Market 2017 - 2021" report covers Executive summary, Scope of the report, Market research methodology, Introduction, Market landscape, Technology landscape, Market segmentation by OSATs and IDMs, Market segmentation by packaging techniques, Geographical segmentation, Key leading countries, Market drivers, Impact of drivers, Market challenges, Impact of drivers and challenges, Market trends, Vendor landscape, Appendix.

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