City of Industry, CA -- (SBWIRE) -- 09/11/2018 -- This study focuses on the production side and consumption side of Underfill, presents the global Underfill market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.
In terms of production side, this report researches the Underfill capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

In terms of consumption side, this report focuses on the consumption of Underfill by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

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The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn't change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.

In China, the high-end underfill products mainly rely on import from foreign developed countries, like US, Germany, Japan. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the R&D, which will certainly weaken the dependence of imports.

The Underfill market was valued at 380 Million US$ in 2017 and is projected to reach 490 Million US$ by 2025, at a CAGR of 3.2% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Underfill.

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This report includes the following manufacturers; we can also add the other companies as you want.

Henkel

WON CHEMICAL

NAMICS

SUNSTAR

Hitachi Chemical

Fuji

Shin-Etsu Chemical

Bondline

AIM Solder

Zymet

Panacol-Elosol

Master Bond

DOVER

Darbond

HIGHTITE

U-bond

Market Segment by Product Type

Semiconductor Underfills

Board Level Underfills

Market Segment by Application

Industrial Electronics

Defense & Aerospace Electronics

Consumer Electronics

Automotive Electronics

Medical Electronics

Others

Key Regions split in this report:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Malaysia

Philippines

Thailand

Vietnam

Europe

Germany

France

UK

Italy

Russia

Central & South America

Brazil

Rest of Central & South America

Middle East & Africa

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