Albany, NY -- (SBWIRE) -- 04/22/2019 -- Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

In 2018, the global Wafer Level Packaging Technologies market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

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This report focuses on the global Wafer Level Packaging Technologies status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Wafer Level Packaging Technologies development in United States, Europe and China.

The key players covered in this study
Samsung Electro-Mechanics
TSMC
Amkor Technology
Orbotech
Advanced Semiconductor Engineering
Deca Technologies
STATS ChipPAC
Nepes

Market segment by Type, the product can be split into
Fan-In Wafer-Level Packaging
Fan-Out Wafer-Level Packaging

Market segment by Application, split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Others

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Wafer Level Packaging Technologies status, future forecast, growth opportunity, key market and key players.
To present the Wafer Level Packaging Technologies development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

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In this study, the years considered to estimate the market size of Wafer Level Packaging Technologies are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

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