Los Angeles, CA -- (SBWIRE) -- 10/20/2018 -- High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for High Density Interconnect.

This study focuses on the production side and consumption side of High Density Interconnect, presents the global High Density Interconnect market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.

In terms of production side, this report researches the High Density Interconnect capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

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In terms of consumption side, this report focuses on the consumption of High Density Interconnect by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report includes the following manufacturers; we can also add the other companies as you want.

IBIDEN Group

Unimicron

AT&S

SEMCO

NCAB Group

Young Poong Group

ZDT

Compeq

Unitech Printed Circuit Board Corp.

LG Innotek

Tripod Technology

TTM Technologies

Daeduck

HannStar Board

Nan Ya PCB

CMK Corporation

Kingboard

Ellington

CCTC

Wuzhu Technology

Kinwong

Aoshikang

Sierra Circuits

Bittele Electronics

Epec

Würth Elektronik

NOD Electronics

San Francisco Circuits

PCBCart

Advanced Circuits

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Market Segment by Product Type

Single Panel

Double Panel

Others

Market Segment by Application

Automotive Electronics

Consumer Electronics

Other Electronic Products

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