HTCC Ceramic Substrates Market New Research Report Announced with business priorities in order to assist companies to realign their business strategies.
Los Angeles, CA -- (SBWIRE) -- 04/19/2019 -- Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
High temperature Ceramic Substrates means that the sintering temperature is around 1,600 °C (2,910 °F).
In the short term, Japan, United States and Europe will have an unshakable status in HTCC ceramic substrates; China will play an more important role in future, driven by the strong demand from consumer electronics, aerospace & military, automobile electronics and LED market.
The global HTCC Ceramic Substrates market was 110 million US$ in 2018 and is expected to 130 million US$ by the end of 2025, growing at a CAGR of 2.3% between 2019 and 2025.
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This report studies the HTCC Ceramic Substrates market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of HTCC Ceramic Substrates in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
NGK Spark Plug
SCHOTT Electronic Packaging
Semiconductor Enclosures Inc(SEI)
By the product type, the market is primarily split into
Al2O3 HTCC Substrate
AIN HTCC Substrate
By the end users/application, this report covers the following segments
Aerospace & Military
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