Pune, India -- (SBWIRE) -- 06/21/2018 -- Market Analysis:

The Global Interposer and Fan-Out WLP Market accounted for USD 10.09 billion in 2016 growing at a CAGR of 30.76% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.

Global Interposer and Fan-Out WLP Market, By Geography; Packaging Technology (Fan-out WLP, Interposers Packaging, TSV Packaging); Application (Imaging & Optoelectronics, LED, Logic,Memory, MEMS/ Sensors, Photonics, Power, Analog & Mixed Signal, Radio Frequency); Vertical (Automotive Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies,Telecommunication, Consumer Electronics) – Industry Trends and Forecast to 2024

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Major Market Competitors:

- Taiwan Semiconductor Manufacturing Company Ltd.
- Samsung Electronics Co., Ltd.
- Toshiba Corp.
- Advanced Semiconductor Engineering Group
- Amkor Technology
- Others

Report Definition:

WLP stands for wafer level packaging. It involves packaging the chip on the wafer, rather than slicing the wafer first into individual chips and then packaging them. Such packaging techniques, deliver greater bandwidth, speed, and reliability. Before WLP, wire-bonding connected chips to a substrate using wires attached to the edges of the chip. Only so many wires could fit around the chip, limiting its data transfer capacity. The wires were also relatively long, which created a timing lag and wasted power.

Market Drivers and Restraints:

- High interconnect density and space efficiencies
- Demand for use in various smart technologies due to compact structure of TSVs
- Provides cost-effective solution.

Market Segmentation:

On the basis of packaging technology:

- Fan-Out WLP
- Interposers Packaging
- TSV Packaging

On the basis of vertical:

- Automotive Industrial Sector
- Medical Devices
- Military & Aerospace
- Smart Technologies
- Telecommunication
- Consumer Electronics

On the basis of application:

- Imaging & Optoelectronics
- Led
- Logic
- Memory
- Mems/ Sensors
- Photonics
- Power
- Analog & Mixed Signal
- Radio Frequency

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On the basis of geography, the global interposer and fan-out WLP market report covers data points for 28 countries across multiple geographies such as:

- North America
- South America
- Europe
- Asia-Pacific
- Middle East & Africa

Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others. In 2017, North America is expected to dominate the market.

Research Methodology:

Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please request an analyst call or can drop down your inquiry.

Some of the key research methodologies used by DBMR Research team is Vendor Positioning Grid, Technology Life Line Curve, Market Time Line Analysis, Market Overview and Guide, Company Positioning Grid, Company Market Share Analysis, Company Sales In Terms Of Hardware, Software, And Services Availed, Multivariate Modeling, Standards of Measurement, Top to Bottom Analysis and Vendor Share Analysis. To know more about of research skills drop an inquiry to speak to our industry experts.

Frequently Asked Questions:

- What will the market size be in 2024?
- What are the key factors driving the global market?
- What are the challenges to market growth?
- Who are the key players in the market?
- What are the market opportunities and threats faced by the key players?
- What will be the growth rate in 2024?
- Which strategies are used by top players in the Global Interposer and Fan-Out WLP Market?

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