New York, NY -- (SBWIRE) -- 07/31/2019 -- It evaluates the data gathered to give an extensive view of the trends and predicts the possible prospects in the forecast period. For this study, the historical data has been collected from the years 2016 and 2017 while considering 2018 as the base year to estimate the growth of the industry in the years 2019 to 2026.
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The LTCC and HTCC market is expected to cross USD 1 billion in the year 2024. The fabrication of Co-Fired Ceramics follows a multilayer approach comprising of green tapes, which consists of ceramic particles mixed with polymer binders and are layered down with other metal structures. Co-Fired Ceramic devices are ceramic microelectronic devices, which are made by firing the entire ceramic structure, conductive, resistive, and dielectric materials in a thermally insulated chamber called 'Kiln,' simultaneously. A kiln is basically a special type of oven that provides enough temperature to carry on processes such as hardening, drying, or a chemical change. Low-temperature Co-Fired Ceramics (LTCC) are made at a temperature below 1,000°C. This is achieved by adding in a glassy phase to the ceramic, which lowers its melting point, while High-temperature Co-Fired Ceramics (HTCC) is made at a temperature above 1,600°C.
LTCC and HTCC boards have several advantages over the traditional printed circuit boards as due to their nature of chemical inactivity and high thermal stability. These factors have increased the demand for Co-Fired Ceramics in various fields such as aerospace & defense, automotive, telecommunication, industrial, and medical. The automotive end-use will witness the highest growth rate in the upcoming years, due to the growing demand for compact and high-performance electronic equipment in automobiles. The LTCC segment is going to dominate the HTCC segment because of the metalizing properties of LTCC, which allows it to metalize with conductive materials such as copper, silver, and gold. Moreover, LTCC also offers other properties such as high compound density, low loss of electrical energy, more functionality, stability, and reliability.
To stay ahead in the rapidly growing market, companies have adopted new strategies such as focusing on new product development to widen their consumer base, forming new partnerships, and acquiring smaller manufacturers. Asia Pacific will be the leader in LTCC and HTCC manufacturing during the forecast years because of the increase in demand for better products, which in turn has pushed the manufacturing rate in this region.
Some of the key findings from our LTCC market and HTCC market forecast
The report highlights the prominent areas of the LTCC and HTCC businesses and evaluates the trends observed in the historical data to conduct an assessment and give a prediction. The report divides the industry based on the process type as LTCC, HTCC, and based on the material type as Glass-Ceramic, Ceramic, and based on the end-user as Automotive, Telecommunications, Aerospace & Defense, Medical and Others to help the reader formulates better business plans and strategies to implement in the future. The demand for the LTCC and HTCC applications, particularly in the automotive and telecommunication businesses is speculated to have a steady rise in the coming years. Key players such as KYOCERA Corporation have developed a tiny, robust ceramic UHF RFID for tracking medical instruments recently in 2018 to stay ahead of the competition. The study highlights the current trends of the business to predict prospective growth and discusses recent developments and the future impact on the LTCC and HTCC businesses.
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Global LTCC and HTCC Market overview
The Global LTCC and HTCC market is expected to deliver a steady development in the forthcoming years. This study offers an analysis of the trends recorded in the historical years to predict the rise in the size, share, demand, gross profits, earnings, and revenue in the upcoming years. The key players profiled here are KYOCERA Corporation, DowDuPont Inc., Murata Manufacturing Co., Ltd., KOA Corporation, Hitachi Metal, Yokowo Co, NGK SPARK PLUG CO, MARUWA Co, Micro Systems Technologies, TDK Corporation, and NIKKO COMPANY among others. The geographical regions covered in this study are North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America. This study gives an in-depth outlook of the global landscape to guide the investors in devising well-informed executive stratagem.
The top players in the LTCC and HTCC market include:
- KYOCERA Corporation
- DowDuPont Inc.
- Murata Manufacturing Co
- KOA Corporation
- Hitachi Metal
- Yokowo Co
- NGK SPARK PLUG CO
- MARUWA Co
- Micro Systems Technologies
- TDK Corporation
- NIKKO COMPANY
Market segment based on process type:
- LTCC
- HTCC
Market segment based on material type:
- Glass Ceramic
- Ceramic
Market segment based on application:
- Automotive
- Telecommunications
- Aerospace & Defense
- Medical
Market segment by Region:
- North America
- Europe
- Asia Pacific
- Middle East and Africa
- Latin America
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