Transparency Market Research

Mask Alignment Lithography Market - the Lithographic Process Need the Orientation Only on One Side of the Device Wafer

Mask Alignment Lithography Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2017 - 2025


Albany, NY -- (SBWIRE) -- 05/01/2018 -- A photomask is a solid plate with transparencies or holes that let light to pass from one side to the other in a predefined pattern. The photomask perform the function of blocking the light in specific areas. Lithographic photomasks are usually translucent fused silica planks covered with a defined pattern with a metal-absorbing film. Usually, photomasks are used at wavelengths of 193 nm, 248 nm and 365 nm. Photomasks are also industrialized for various forms of energy such as 13.5 nm (EUV), 157 nm, electrons, ions and X-ray; but these radiations need entirely new constituents meant for substrate and the mask film. Mask alignments are done by using a mask aligner machine. This machine transfers the desired pattern onto the wafer. The mask with the desired pattern is placed over the wafer. After that, the mask is exposed to ultraviolet light. The light transmits only through the openings in the mask allowing the pattern to be burned into the photoresist present in the wafer.

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Instances where the lithographic process need the orientation only on one side of the device wafer. The top side orientation is utilized for aligning the architecture on the mask with those of the wafer. Substrate customization can be achieved by live image alignment or by using stored data.

Sustainable growth in the global semiconductor market is acting as a key driver for the growth of the overall mask alignment lithography market. The upsurge in sales of consumer electronic devices and microelectronics is expected to fuel the global market. As the demand for semiconductor devices are increasing, so is the need for better speed and advanced integration methods. To be relevant in the market, the vendors operating in the semiconductor production equipment market are speeding up their development efforts.

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In lithography, the advancement of the future mask alignment lithography systems are in progress. Suggestions are also being made for processes that utilizes ArF (Argon fluoride) exposure systems to develop various semiconductor materials to support further miniaturization. In this era of miniaturization, customization and fast and efficient delivery, the global mask alignment lithography systems will play a pivotal role in attaining the same, thereby offering a significant growth opportunity for the market.