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Micro Tactical Ground Robot Market - Need for Error Free Process to Augment Demand Globally

Micro Tactical Ground Robot Market Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025


Albany, NY -- (SBWIRE) -- 08/07/2017 -- Transparency Market Research (TMR) states in a research report that the global e-beam wafer inspection system market is extremely consolidated owing to the fact that the leading four players accounted more than 40% in 2016. The top drawer companies operating in the market are Lam Research Corporation, KLA Tencor, Applied Materials, Inc., and ASML. The competition among these is expected to rise at an extensive rate as they have a trait in common that is their inclination towards research and development activities for manufacturing products with innovative advancements and identify any fault in the semiconductor wafers. The crème players are incessantly concentrating on innovation for offering high-end fault detection processes and so that the e-beam wafer inspection system can be employed in numerous application such as laptops and smartphones.

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Other than this, experts have also have a pragmatic view on the significant upsurge in the number of acquisitions in the coming years as comparison to the ones that have occurred in the last couple of years. Keeping in mind the versatile business environment, companies are being encourages to enter into strategy agreements and also being intrigued by the skeptical characteristic of the semiconductor industry.

According to a TMR analyst, "The global market for e-beam wafer inspection system is expected to witness an impressive CAGR of 17.5% from 2017 and 2025. Rising from a valuation of US$248.3 mn in 2016, the market has been projected to touch US$1.06 bn by 2025.

Detection Imaging to Lead in terms of Application

On the basis of type, the global market for e-beam wafer inspection system can be segmented into more than 10 nm, 1 to 10 nm, and less than 1 nm inspection resolution system. The global market for e-beam wafer inspection system was ruled by the more than 10 nm wafer inspection systems closely trailed by the other two segments. Nevertheless, over the forecast period, the segment of less than 1 nm is expected to exhibit a greater CAGR as compared to others. Based on application, the market has been classified into inspector recipe optimization, reticle quality inspection, wafer dispositioning, bare wafer OQC/IQC, lithographic qualification, and defect imaging.

Region-wise, the market has been segmented into the Middle East and Africa, Latin America, North America, Europe, and Asia Pacific. Amongst all these, the region that surfaced dominant was Asia Pacific with a share of approximately 60% in 2016. Europe and North America have also been exhibiting lucrative growth opportunities for the vendors to capitalize on. The demand for e-beam wafer inspection is expected to be high in emerging countries of Asia Pacific.

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Miniaturization to be Key Factor behind Implementation

Wafers are important equipment that are integrated in compact devices. It is imperative to inspect for defects and faults for these devices to run error-free for a long time. E-beam inspection system aids in the detection of the presence of any errors of faults in compact devices such as smartphones, laptops, MEMs, among many others. Henceforth, with the growing demand for miniaturization which is aimed at enhancing the complete performance across several industries, the use of these wafer inspection systems is expected to rise, thus providing impetus to the market. E-beam id employed for detecting faults in the voltage-contrast along with minute defects. It further helps in decreasing the charging of the wafer surface. These factors are likely to supplement the progress of the market in the years ahead. However, the market might face challenges from the advent of alternate inspection devices across several regions.