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Oxygen-Free Copper Market Research, Global Industry Demand and Forecast 2024.

Global Oxygen-Free Copper Market, By Grade (Cu-OF, Cu-OFE), By Product Form (Wires, Strips, Busbars, Rods), By Application (Electronics & Electrical {High Resistance-Ratio Cryogenic Shunts, Bus Conductors, High-End Audio-Visual Systems, Microwave Tubes & Glass-To-Metal Seals}, Transport {Automotive Rectifiers, Vacuum Tubes, Busbars & Coaxial Cables}) – Industry Trends and Forecast to 2024

 

Pune, India -- (SBWIRE) -- 02/07/2018 -- The Global Oxygen-Free Copper Market accounted for USD 14.90 billion in 2016 and is projected to grow at a CAGR of 4.5% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic years 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.

Market Definition: Global Oxygen-Free Copper Market

Oxygen free copper (OFC) is one of the purest form of copper available for different industrial and commercial applications. This alloy has excellent material properties like superior elongation and good corrosion-resistance. It is used in manufacturing coaxial cables and communication cables for the telecommunication industry. There is a growing demand for OFC in electronics & electrical and transport industries, which is expected to be one of the major drivers of the market over the next seven years.

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Major Market Drivers:



- High demand for oxygen-free copper in the electronics & electricals sector

- Strong demand for oxygen-free copper from the Asia-Pacific

- Advantages of pure copper


Market Restraint:



- High cost of oxygen-free copper processing

- Availability of substitute like electrolytic tough pitch (ETP) copper


Market Segmentation: Global Oxygen-Free Copper Market

The oxygen-free copper market is segmented on the basis of grade into Cu-OF and Cu-OFE. The Cu-OF segment is further sub segmented into magnetometers and electromagnets. The Cu-OFE segment is further sub segmented into rectifiers and transistors.

On the basis of product form, the market is segmented into wires, strips, busbars and rods.

On the basis of application, the market is segmented into electronics & electrical and transport. The electronics & electrical segment is further sub segmented into high resistance-ratio cryogenic shunts, bus conductors, high-end audio-visual systems, microwave tubes and glass-to-metal seals. The transport segment is further sub segmented into automotive rectifiers, vacuum tubes, busbars and coaxial cables.

On the basis of geography, the oxygen-free copper market report covers data points for 28 countries across multiple geographies such as North America, South America, Europe, Asia-Pacific and Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others.

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Competitive Landscape: Global Oxygen-Free Copper Market

The global oxygen-free copper market is fragmented with the presence of a large number of players across different regions. These major players have adopted various organic as well as inorganic growth strategies such as mergers & acquisitions, new product launches, expansions, agreements, joint ventures, partnerships, and others to strengthen their position in this market.

Major Market Competitors: Global Oxygen-Free Copper Market

Some of the major players in oxygen-free copper market include KGHM Polska Miedz SA, Sh Copper Products Co., Ltd., Mitsubishi Materials Corporation, Luvata, National Bronze & Metals, Inc., SAM Dong America, Citizen Metalloys Limited, Freeport-Mcmoran Inc., Metrod Holdings Berhad, Zhejiang Libo Holding Group Co., Ltd., Pan Pacific Copper Co., Ltd., Watteredge LLC, KME Germany GmbH & Co Kg, Wieland-Werke AG, Cupori Oy, Mkm Mansfelder Kupfer Und Messing GmbH, Farmers Copper Ltd., Aurubis Ag, Shanghai Metal Corporation, Aero Industries, Ibc Advanced Alloys Corporation, Sequoia Brass & Copper and many more.

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