Research Beam

Plating for Microelectronics Market Growth Research Report 2018

The report helps to recognize the possible future investment pockets, thereby, promotes collaborations among vendors. It anticipates challenges and restraints of the industry which help producers and key stakeholders to take corrective steps.

 

Portland, OR -- (SBWIRE) -- 03/12/2018 -- Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

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Scope of the Report:
This report focuses on the Plating for Microelectronics in global market, especially in North America, Europe, Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, types and applications.
Market Segment by Manufacturers, this report covers
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

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Market Segment by Type, covers
Electroplating
Electroless
Immersion

Market Segment by Applications, can be divided into
Gold
Zinc
Nickel
Bronze
Tin
Copper

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