Fast Market Research

Recent Study: Global Fan-in Wafer Level Packaging Market 2016-2020

Fast Market Research announces the availability of the new TechNavio report, "Global Fan-in Wafer Level Packaging Market 2016-2020", on their comprehensive research portal


Boston, MA -- (SBWIRE) -- 11/30/2016 -- Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.

Technavio's analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor

Get More Details on this Report and a Full Table of Contents at Global Fan-in Wafer Level Packaging Market 2016-2020

The market is divided into the following segments based on geography:

-North America

Technavio's report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

-Texas Instruments

Other prominent vendors

-Rudolph Technologies
-SUSS MicroTec
-FlipChip International

Market driver

-High demand for miniaturized electronics
-For a full, detailed list, view our report

Market challenge

-Cyclical nature of semiconductor industry
-For a full, detailed list, view our report

Market trend

-Increase in wafer size
-For a full, detailed list, view our report

Key questions answered in this report

-What will the market size be in 2020 and what will the growth rate be?
-What are the key market trends?
-What is driving this market?
-What are the challenges to market growth?
-Who are the key vendors in this market space?
-What are the market opportunities and threats faced by the key vendors?
-What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Companies Mentioned in this Report: STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International

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