The Report Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. - MarketResearchReports.biz
Albany, NY -- (SBWIRE) -- 06/02/2015 -- Overheating is the most critical issue in the computer industry. It limits further miniaturisation, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren't monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials.
The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.
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Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.
The most appropriate choice of thermal interface material has been shown to:
Reduce total cost of ownership
Eliminate of the need for liquid cooling
Reduce system cooling power consumption
Reduce building power consumption
Increase operational lifetime
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The geographic breakdown of sales of thermal interface materials, included in Thermal Interface Materials 2015-2025, demonstrates this is truly a global industry:
Innovation in this industry is driven forward by
Faster computers: With electronic systems becoming faster, hotter, more compact, and portable, the need for better TIMs in consumer and industrial computing will continue.
Greener lighting: LEDs are replacing traditional lighting in more applications, for lower energy and higher brightness, especially in the automotive industry.
Electrification of transport: Heat management is of very high importance in electric vehicles, which have large energy storage systems. As vehicles incorporate more and more electrics and electronics, thermal management will become increasingly important.
Better connectivity: As a wider-reaching and more comprehensive wireless network is built, and higher reliability is expected, more, better quality TIM is being used in telecommunications equipment.
Thermal Interface Materials 2015-2025 includes a technology appraisal of the ten key technologies:
Pressure-Sensitive Adhesive Tapes
Thermal Gels, Pastes and Liquids
Phase Change Materials
Solders and Phase Change Metals
Compressible Interface Materials
The technologies and chemistries are described and compared, and performance data from a wide selection of commercially available products is benchmarked.
There are many current and growing opportunities for these technologies to be used in the following markets:
Defence and aerospace electronics
Consumer and mobile handheld electronics
Wireless sensor networks
PCB testing equipment
The importance and uses of TIMs in these industries, the materials used most frequently and the market size is presented.
The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated by TIM type and by application. These have been compiled after an extensive interview program with thermal interface material manufacturers making a variety of materials, and many different applications, and using financial data published by public companies. Thermal Interface Materials 2015-2025 includes profiles of 29 companies working in this industry.
Table of Contents
1. EXECUTIVE SUMMARY
1.1. Potential benefits of using TIMs
1.2. Drivers for the improvement of TIMs
1.3. Ten Types of Thermal Interface Material
1.4. Factors which influence the choice of TIM
1.5. Properties of Thermal Interface Materials
1.6. Uses for thermal interface materials
1.7. Materials by Application
1.8. Thermal Interface Material Manufacturers
1.9. Cost of TIM
1.10. Market Share by TIM type in 2015
1.11. Market Share by Application in 2015
1.12. Market Share of Computing in 2015
1.13. Geographic Breakdown
1.14. Forecast by TIM type
1.15. Forecast by Application
1.16. Forecast for Computing Applications
1.18. Opportunities for developments
1.19. Growing Markets
2.1. Schematics to show the role of Thermal Interface Materials
3.1. Causes of Electronic Failure
3.2. Temperature increase in Power Electronic Applications
3.3. Reducing temperature in Power Electronics Applications
3.4. Potential benefits of using TIMs
3.5. Drivers for the improvement of TIMs
3.6. Fishbone Diagram
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